DSPIC30F2010T-30I/MM Microchip Technology, DSPIC30F2010T-30I/MM Datasheet - Page 162

• Manufacturer Part Number: DSPIC30F2010T-30I/MM
• Description: IC,DSP,16-BIT,CMOS,LLCC,28PIN,PLASTIC
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F2010T-30I/MM

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 30 MIPs
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
• Number Of I /o: 20
• Program Memory Size: 12KB (4K x 24)
• Program Memory Type: FLASH
• Eeprom Size: 1K x 8
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-QFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

dsPIC30F2010
FIGURE 22-6:
TABLE 22-21: BAND GAP START-UP TIME REQUIREMENTS
DS70118J-page 162
AC CHARACTERISTICS
SY40
Note 1:
Param
(see Note)
Note: Band Gap is enabled when FBORPOR<7> is set.
Enable Band Gap
No.
2:
T
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated.
Symbol
BGAP
0V
Band Gap Start-up Time
BAND GAP START-UP TIME CHARACTERISTICS
Characteristic
(1)
SY40
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature
Min
—
Typ
40
(2)
Max
65
Units
-40°C ≤ T
-40°C ≤ T
µs
Defined as the time between the
instant that the band gap is enabled
and the moment that the band gap
reference voltage is stable.
RCON<13>Status bit
A
A
≤ +85°C for Industrial
≤ +125°C for Extended
© 2011 Microchip Technology Inc.
Conditions
V
BGAP
Band Gap
Stable