DSPIC33FJ16MC102-E/SO Microchip Technology, DSPIC33FJ16MC102-E/SO Datasheet - Page 248
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DSPIC33FJ16MC102-E/SO
Manufacturer Part Number
DSPIC33FJ16MC102-E/SO
Description
16-bit Motor Control DSC Family, 16 MIPS, 16KB Flash, 1KB RAM 28 SOIC .300in TUB
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheet
1.DSPIC33FJ16GP101-IP.pdf
(322 pages)
Specifications of DSPIC33FJ16MC102-E/SO
Processor Series
dsPIC33F
Core
dsPIC
Data Bus Width
16 bit
Program Memory Type
Flash
Program Memory Size
16 KB
Interface Type
SPI, I2C, UART, JTAG
Number Of Programmable I/os
35
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 125 C
Development Tools By Supplier
MPLAB IDE Software
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 13 Channel
Core Processor
dsPIC
Core Size
16-Bit
Speed
16 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, Motor Control PWM, POR, PWM, WDT
Number Of I /o
21
Eeprom Size
-
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
28-SOIC (0.295", 7.50mm Width)
Lead Free Status / Rohs Status
Details
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dsPIC33FJ16GP101/102 AND dsPIC33FJ16MC101/102
26.1
TABLE 26-1:
TABLE 26-2:
TABLE 26-3:
DS70652C-page 248
Characteristic
Industrial Temperature Devices
Extended Temperature Devices
Power Dissipation:
Internal chip power dissipation:
I/O Pin Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 18-pin PDIP
Package Thermal Resistance, 20-pin PDIP
Package Thermal Resistance, 28-pin SPDIP
Package Thermal Resistance, 18-pin SOIC
Package Thermal Resistance, 20-pin SOIC
Package Thermal Resistance, 28-pin SOIC
Package Thermal Resistance, 20-pin SSOP
Package Thermal Resistance, 28-pin SSOP
Package Thermal Resistance, 28-pin QFN (6x6 mm)
Package Thermal Resistance, 36-pin TLA (5x5 mm)
Note 1:
DC5
I/O = Σ ({V
DC Characteristics
P
Operating Junction Temperature Range
Operating Ambient Temperature Range
Operating Junction Temperature Range
Operating Ambient Temperature Range
INT
Junction to ambient thermal resistance, Theta-
= V
DD
OPERATING MIPS VS. VOLTAGE
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
DD
x (I
– V
V
DD
3.0V-3.6V
3.0V-3.6V
(in Volts)
DD
OH
Characteristic
– Σ I
Range
} x I
Rating
OH
OH
)
) + Σ (V
OL
x I
OL
-40°C to +125°C
)
Preliminary
-40°C to +85°C
Temp Range
(in °C)
JA
(
θ
JA
) numbers are achieved by package simulations.
Symbol
Symbol
P
DMAX
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
P
T
T
T
T
JA
JA
JA
JA
JA
JA
JA
JA
JA
JA
A
A
D
J
J
31.1
Min
Typ
-40
-40
-40
-40
dsPIC33FJ16GP101/102 and
50
50
50
63
63
55
90
71
37
dsPIC33FJ16MC101/102
(T
P
© 2011 Microchip Technology Inc.
J
INT
– T
Max
Typ
Max MIPS
—
—
—
—
—
—
—
—
—
—
—
—
—
—
+ P
A
)/θ
16
16
I
/
O
JA
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
+125
+140
+125
°C/W
Max
Unit
+85
Notes
Unit
°C
°C
°C
°C
W
W
1
1
1
1
1
1
1
1
1
1
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