EVAL-AD5663REBZ Analog Devices Inc, EVAL-AD5663REBZ Datasheet - Page 27

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EVAL-AD5663REBZ

Manufacturer Part Number
EVAL-AD5663REBZ
Description
Evaluation Board I.c.
Manufacturer
Analog Devices Inc
Series
nanoDAC™r
Datasheet

Specifications of EVAL-AD5663REBZ

Number Of Dac's
2
Number Of Bits
16
Outputs And Type
2, Single Ended
Sampling Rate (per Second)
220k
Data Interface
Serial
Settling Time
4µs
Dac Type
Voltage
Voltage Supply Source
Single
Operating Temperature
-40°C ~ 105°C
Utilized Ic / Part
AD5663
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
The power supply to the AD5663R should be bypassed with
10 μF and 0.1 μF capacitors. The capacitors should be located as
close as possible to the device, with the 0.1 μF capacitor ideally
right up against the device. The 10 μF capacitors are the
tantalum bead type. It is important that the 0.1 μF capacitor
have low effective series resistance (ESR) and effective series
inductance (ESI), which is found, for example, in common
ceramic types of capacitors.
This 0.1 μF capacitor provides a low impedance path to ground
for high frequencies caused by transient currents due to internal
logic switching.
Rev. C | Page 27 of 28
The power supply line itself should have as large a trace as
possible to provide a low impedance path and to reduce glitch
effects on the supply line. Clocks and other fast switching
digital signals should be shielded from other parts of the board
by digital ground. Avoid crossover of digital and analog signals,
if possible. When traces cross on opposite sides of the board,
ensure that they run at right angles to each other to reduce
feedthrough effects through the board. The best board layout
technique is the microstrip technique, where the component
side of the board is dedicated to the ground plane only and the
signal traces are placed on the solder side. However, this is not
always possible with a 2-layer board.
AD5623R/AD5643R/AD5663R

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