EVAL-ADUMQSEBZ Analog Devices Inc, EVAL-ADUMQSEBZ Datasheet - Page 3

• Manufacturer Part Number: EVAL-ADUMQSEBZ
• Description: EVAL BD For QSOP & SOIC16 Dig Isolators
• Manufacturer: Analog Devices Inc
• Series: iCoupler®r

Specifications of EVAL-ADUMQSEBZ

• Main Purpose: Bare Evaluation Board
• Embedded: No
• Primary Attributes: For Use with iCoupler® 16 SOIC/QSOP
• Rohs Compliant: YES
• Silicon Manufacturer: Analog Devices
• Kit Application Type: Interface
• Application Sub Type: Isolator
• Features: On-board Signal Routing, Simple Signal Paths To Reduce Transmission Line Effects
• Silicon Core Number: ADuM
• Kit Contents: Board, Docs
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Utilized Ic / Part: -
• Secondary Attributes: -
• Lead Free Status / Rohs Status: Supplier Unconfirmed
• Other names: Q5310415; Q5674388; T1208681

Evaluation Board User Guide
EVALUATION BOARD HARDWARE
PAD LAYOUT FOR THE DUT
The evaluation board has a pad layout in U2 that accommo-
dates 16-lead, wide-body SOIC devices, as well as QSOP
miniature packages, as shown in Figure 2. Power and ground
connections connect to capacitor pads for Side 1 and Side 2.
Three low inductance, surface-mount bypass capacitors are
provided for each side. A 100 nF capacitor is installed on each
side in Capacitor C2 and Capacitor C3. Additional bypass
capacitors required for QSOP packages are below the QSOP
pads and within the pad layout of the SOIC package. They
cannot be installed if the SOIC is used.
In addition, there are 10 μF ceramic X7R capacitors, C1 on Side 1
and C4 on Side 2, that provide high frequency bypassing and
ripple reduction. For further ripple reduction in isoPower®
devices like the ADuM540x, tantalum capacitors are added to
C10 as a 68 μF value on Side 1 and to C5 as a 22 μF value on
Side 2. These large value ceramic and tantalum bypass capacitors
are not necessary for non-isoPower devices.
Many of the iCoupler devices have configuration pins that allow
outputs to be disabled or default levels to be set. These pins are
usually located at Pin 7 and Pin 10 in the wide-body package. Pull-
up 0 Ω resistors on SM Pad R4 and SM Pad R17 are provided to
pull these pins high. These pull-up resistors can be removed,
and pull-down resistors can be installed on R5 and R18.
In addition to the U2 DUT space, an additional pad layout is
provided at U1, specifically to accommodate an ADuM5000
isoPower device, as shown in Figure 3. This is a power supply
only device that can be used to provide secondary power for
any iCoupler in standalone mode or as a slave to boost power to
the ADuM520x or ADuM540x devices. The surface-mount
resistor pads that are used to control these functions are not
populated.
An ADuM5000 is not installed at Position U1; it is left to the
user to obtain and install this device if required. As shown in
Figure 3, the power and ground connections for this device are
different from the rest of the iCoupler components. The C6 to
C9 pad positions for bypass capacitors are provided but not
populated (0.1 μF X7R ceramic capacitors are recommended).
Figure 2. DUT Pad Layout Component U2
Rev. A | Page 3 of 8
Pull-up, pull-down, and connecting resistor pads are provided
(but not populated) to connect the ADuM5000 in master or slave
mode, as well as to set the output voltage. See the
data sheet for descriptions of the pin functions.
Grounding Scheme
The board consists of two separate ground and power systems.
Each side of the DUT can be operated from an independent
power and ground reference. This allows simulation of
conditions similar to the target application. The board provides
for board creepage and clearance typical of most 2.5 kV circuit
boards. It is not recommended for use above 2.5 kV rms transient
voltages or for isolation voltage testing above 2500 V rms.
EMI and EMC Measurements
The signal path has been made as simple as possible while still
providing flexibility. The board is not intended for detailed
characterization of system noise, EMI, or EMC. It may be useful
for initial bench work in these areas, but Analog Devices, Inc.,
does not guarantee that board results will be indicative of the
final system performance in these areas. The board includes
some of the structures discussed in the AN-0971 Application
Note for radiated EMI mitigation.
TERMINALS
Side 1 Power Supply Inputs
Power is supplied to the board via a set of terminal block
connectors labeled IO_1C, as shown in Figure 4. Power is
connected to the Pin 1 top terminal, and ground is connected to
the Pin 2 top terminal. Provisions for adding in-line inductors
for noise isolation have been made with the inclusion of Z1 and
Z2, which are 1206 size surface-mount components. These
positions are populated with 0 Ω resistors to connect power to
the board. If ferrite inductors are required for noise control,
these components should be removed and replaced with
appropriate inductors.
Figure 3. ADuM5000 Pad Layout Component U1
ADuM5000
UG-042