BTA212B-800B /T3 NXP Semiconductors, BTA212B-800B /T3 Datasheet
BTA212B-800B /T3
Specifications of BTA212B-800B /T3
Related parts for BTA212B-800B /T3
BTA212B-800B /T3 Summary of contents
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... T 99 ˚C mb full sine wave ˚C prior to j surge 16 0 / over any period - Product specification BTA212B series B MAX. MAX. MAX. UNIT 600B 800B 500 600 800 SYMBOL T2 MAX. UNIT -500 -600 -800 1 1 500 600 800 12 95 105 45 100 ...
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... 125 ˚ 125 ˚C D DRM(max) j CONDITIONS 125 ˚C; DM DRM(max) j exponential waveform; gate open circuit V = 400 125 ˚ T(RMS) without snubber; gate open circuit 0 DRM(max / Product specification BTA212B series B MIN. TYP. MAX. UNIT - - 1.5 K 2.0 K K/W MIN. TYP. MAX. UNIT ...
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... I p 20ms. VGT(25 C) 1.6 I TSM 1.4 time T 1.2 1 0.8 0.6 0.4 100 1000 - Product specification BTA212B series B BT138 100 Tmb / C BT138 0.1 1 surge duration / s , versus surge duration, for sinusoidal T(RMS) currents Hz; T 99˚C. mb VGT(Tj) BT136 0 50 100 Fig.6. Normalised gate trigger voltage )/ V (25˚ ...
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... Fig.11. Transient thermal impedance dIcom/dt (A/ms) 1000 100 100 150 ( (25˚C), Fig.12. Typical, critical rate of change of commutating current Product specification BTA212B series B BT138 typ max 0.5 1 1 BT138 unidirectional bidirectional 0.1ms 1ms 10ms 0.1s 1s 10s versus th j-mb pulse width t ...
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... September 1997 10.3 max 11 max 15.4 0.85 max (x2) Fig.13. SOT404 : centre pin connected to mounting base. 11.5 9.0 2.0 3.8 5.08 Fig.14. SOT404 : minimum pad sizes for surface mounting . 5 Product specification BTA212B series B 4.5 max 1.4 max 2.5 0.5 17.5 Rev 1.200 ...
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... Philips customers using or selling these products for use in such applications their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. September 1997 BTA212B series B 6 Product specification Rev 1.200 ...