BLF6G38-50 NXP Semiconductors, BLF6G38-50 Datasheet - Page 11
![RF MOSFET Small Signal LDMOS TNS](/photos/40/60/406026/sot502a_sml.jpg)
BLF6G38-50
Manufacturer Part Number
BLF6G38-50
Description
RF MOSFET Small Signal LDMOS TNS
Manufacturer
NXP Semiconductors
Datasheet
1.BLF6G38-50.pdf
(13 pages)
Specifications of BLF6G38-50
Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
0.29 Ohms
Drain-source Breakdown Voltage
65 V
Gate-source Breakdown Voltage
13 V
Continuous Drain Current
16.5 A
Maximum Operating Temperature
+ 225 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 65 C
Package / Case
SOT502B
Channel Type
N
Channel Mode
Enhancement
Drain Source Voltage (max)
65V
Output Power (max)
70W(Typ)
Power Gain (typ)@vds
14@28VdB
Frequency (min)
3.4GHz
Frequency (max)
3.6GHz
Package Type
LDMOST
Pin Count
3
Forward Transconductance (typ)
5.6S
Drain Source Resistance (max)
290@6.15Vmohm
Reverse Capacitance (typ)
1.17@28VpF
Operating Temp Range
-65C to 200C
Drain Efficiency (typ)
23%
Mounting
Screw
Mode Of Operation
1-Carrier N-CDMA
Number Of Elements
1
Vswr (max)
10
Screening Level
Military
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
BLF6G38-50,112
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
BLF6G38-50
Manufacturer:
NXP
Quantity:
120
Company:
Part Number:
BLF6G38-50
Manufacturer:
NXP
Quantity:
1 000
NXP Semiconductors
12. Legal information
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[1]
[2]
[3]
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BLF6G38-50_BLF6G38LS-50
Product data sheet
Document status
Objective [short] data sheet
Preliminary [short] data sheet
Product [short] data sheet
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
[1][2]
Product status
Development
Qualification
Production
[3]
All information provided in this document is subject to legal disclaimers.
This document contains data from the preliminary specification.
This document contains the product specification.
Definition
This document contains data from the objective specification for product development.
Rev. 02 — 1 June 2010
BLF6G38-50; BLF6G38LS-50
malfunction of an NXP Semiconductors product can reasonably be expected
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Limiting values — Stress above one or more limiting values (as defined in
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Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
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