BAV70,215 NXP Semiconductors, BAV70,215 Datasheet
BAV70,215
Specifications of BAV70,215
933184910215
BAV70 T/R
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BAV70,215 Summary of contents
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BAV70 series High-speed switching diodes Rev. 07 — 27 November 2007 1. Product profile 1.1 General description High-speed switching diodes, encapsulated in small Surface-Mounted Device (SMD) plastic packages. Table 1. Type number Package BAV70 BAV70M BAV70S BAV70T BAV70W 1.2 Features ...
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... NXP Semiconductors 2. Pinning information Table 3. Pin BAV70; BAV70T; BAV70W BAV70M BAV70S Ordering information Table 4. Type number BAV70 BAV70M BAV70S BAV70T BAV70W BAV70_SER_7 Product data sheet Pinning Description anode (diode 1) anode (diode 2) common cathode anode (diode 1) anode (diode 2) common cathode anode (diode 1) ...
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... NXP Semiconductors 4. Marking Table 5. Type number BAV70 BAV70M BAV70S BAV70T BAV70W [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per diode V RRM FRM I FSM BAV70_SER_7 ...
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... NXP Semiconductors Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol P tot Per device amb T stg [ prior to surge. j [2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [3] Reflow soldering is the only recommended soldering method. ...
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... NXP Semiconductors 7. Characteristics Table unless otherwise specified. amb Symbol Per diode [1] Pulse test: t [2] When switched from I [3] When switched from I BAV70_SER_7 Product data sheet Characteristics Parameter Conditions forward voltage 150 mA F reverse current diode capacitance V R reverse recovery time forward recovery voltage 300 s ...
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... NXP Semiconductors (mA (1) (2) (3) ( 0.2 0.6 ( 150 C amb ( amb ( amb ( amb Fig 1. Forward current as a function of forward voltage; typical values ( ( ( ( ( 150 C amb ( amb ( amb ( amb Fig 3. Reverse current as a function of reverse voltage; typical values BAV70_SER_7 Product data sheet 006aab107 I FSM 1.0 1 ...
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... NXP Semiconductors 8. Test information D.U. ( Input signal: reverse pulse rise time t Oscilloscope: rise time Fig 5. Reverse recovery time test circuit and waveforms 450 D.U.T. Input signal: forward pulse rise time t Fig 6. Forward recovery voltage test circuit and waveforms BAV70_SER_7 Product data sheet ...
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... NXP Semiconductors 9. Package outline 3.0 2.8 3 2.5 1.4 2.1 1.2 1 1.9 Dimensions in mm Fig 7. Package outline BAV70 (SOT23/TO-236AB) 2.2 1 2.2 1.35 2.0 1.15 pin 1 index 1 2 0.65 1.3 Dimensions in mm Fig 9. Package outline BAV70S (SOT363/SC-88) Fig 11. Package outline BAV70W (SOT323/SC-70) BAV70_SER_7 Product data sheet 1 ...
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... NXP Semiconductors 10. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package BAV70 BAV70M BAV70S BAV70T BAV70W [1] For further information and the availability of packing methods, see [2] T1: normal taping [3] T2: reverse taping 11. Soldering Fig 12. Refl ...
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... NXP Semiconductors 4.60 Fig 13. Wave soldering footprint BAV70 (SOT23/TO-236AB) Fig 14. Reflow soldering footprint BAV70M (SOT883/SC-101) BAV70_SER_7 Product data sheet 3.40 1.20 (2x) 2 4.00 1.20 3 2.80 4. 0.05 ( 0.90 0. solder lands solder paste Reflow soldering is the only recommended soldering method. ...
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... NXP Semiconductors Fig 15. Reflow soldering footprint BAV70S (SOT363/SC-88) Dimensions in mm Fig 16. Wave soldering footprint BAV70S (SOT363/SC-88) BAV70_SER_7 Product data sheet 2.35 solder lands 0.50 solder paste (4 ) solder resist 0.50 occupied area (4 ) Dimensions in mm 5.25 4.50 solder lands 1.15 3.75 solder resist ...
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... NXP Semiconductors Fig 17. Reflow soldering footprint BAV70T (SOT416/SC-75) Fig 18. Reflow soldering footprint BAV70W (SOT323/SC-70) Fig 19. Wave soldering footprint BAV70W (SOT323/SC-70) BAV70_SER_7 Product data sheet 2.0 0.85 0.6 (3x) Dimensions in mm 2.65 0.75 1.325 1. 0.60 2. 2.40 4.60 4.00 1.15 ...
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... Release date BAV70_SER_7 20071127 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Type number BAV70M added • ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 15. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 7 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 10 Packing information Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 12 Revision history ...