BAV70,215 NXP Semiconductors, BAV70,215 Datasheet

DIODE SW DBL 100V 215MA HS SOT23

BAV70,215

Manufacturer Part Number
BAV70,215
Description
DIODE SW DBL 100V 215MA HS SOT23
Manufacturer
NXP Semiconductors
Datasheet
1.BAV70235.pdf (15 pages)

Specifications of BAV70,215

Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Voltage - Forward (vf) (max) @ If
1V @ 50mA
Current - Reverse Leakage @ Vr
500nA @ 80V
Current - Average Rectified (io) (per Diode)
215mA (DC)
Voltage - Dc Reverse (vr) (max)
100V
Reverse Recovery Time (trr)
4ns
Diode Type
Standard
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Diode Configuration
1 Pair Common Cathode
Mounting Type
Surface Mount
Product
Switching Diodes
Peak Reverse Voltage
100 V
Forward Continuous Current
0.215 A
Max Surge Current
4 A
Configuration
Dual Common Cathode
Recovery Time
4 ns
Forward Voltage Drop
1.25 V
Maximum Reverse Leakage Current
0.5 uA
Operating Temperature Range
+ 150 C
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 65 C
Mounting Style
SMD/SMT
Rectifier Type
Switching Diode
Peak Rep Rev Volt
100V
Avg. Forward Curr (max)
0.215A
Rev Curr
0.5uA
Peak Non-repetitive Surge Current (max)
4A
Forward Voltage
1.25V
Operating Temp Range
-65C to 150C
Package Type
TO-236AB
Rev Recov Time
4ns
Operating Temperature Classification
Military
Mounting
Surface Mount
Pin Count
3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-1622-2
933184910215
BAV70 T/R

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Bonase Electronics (HK) Co., Limited Bonase Electronics (HK) Co., Limited
Part Number:
BAV70,215
Manufacturer:
NXP Semiconductors
Quantity:
20 000
Company:
Meier Automation Equipment Co., Limited Meier Automation Equipment Co., Limited
Part Number:
BAV70,215
Manufacturer:
NXP/恩智浦
Quantity:
20 000
1. Product profile
1.1 General description
1.2 Features
1.3 Applications
1.4 Quick reference data
High-speed switching diodes, encapsulated in small Surface-Mounted Device (SMD)
plastic packages.
Table 1.
I
I
I
I
I
Table 2.
[1]
Type number Package
BAV70
BAV70M
BAV70S
BAV70T
BAV70W
Symbol
Per diode
I
V
t
R
rr
R
BAV70 series
High-speed switching diodes
Rev. 07 — 27 November 2007
High switching speed: t
Low leakage current
Small SMD plastic packages
High-speed switching
General-purpose switching
When switched from I
Product overview
Quick reference data
Parameter
reverse current
reverse voltage
reverse recovery time
NXP
SOT23
SOT883
SOT363
SOT416
SOT323
F
= 10 mA to I
JEITA
-
SC-101
SC-88
SC-75
SC-70
rr
4 ns
R
= 10 mA; R
JEDEC
TO-236AB small
-
-
-
-
Conditions
V
R
= 80 V
L
= 100 ; measured at I
I
I
Low capacitance: C
Reverse voltage: V
Package
configuration
leadless ultra
small
very small
ultra small
very small
[1]
Min
-
-
-
R
= 1 mA.
Configuration
dual common cathode
dual common cathode
quadruple common
cathode/common cathode
dual common cathode
dual common cathode
Typ
-
-
-
Product data sheet
R
d
100 V
1.5 pF
Max
0.5
100
4
Unit
V
ns
A

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BAV70,215 Summary of contents

Page 1

BAV70 series High-speed switching diodes Rev. 07 — 27 November 2007 1. Product profile 1.1 General description High-speed switching diodes, encapsulated in small Surface-Mounted Device (SMD) plastic packages. Table 1. Type number Package BAV70 BAV70M BAV70S BAV70T BAV70W 1.2 Features ...

Page 2

... NXP Semiconductors 2. Pinning information Table 3. Pin BAV70; BAV70T; BAV70W BAV70M BAV70S Ordering information Table 4. Type number BAV70 BAV70M BAV70S BAV70T BAV70W BAV70_SER_7 Product data sheet Pinning Description anode (diode 1) anode (diode 2) common cathode anode (diode 1) anode (diode 2) common cathode anode (diode 1) ...

Page 3

... NXP Semiconductors 4. Marking Table 5. Type number BAV70 BAV70M BAV70S BAV70T BAV70W [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per diode V RRM FRM I FSM BAV70_SER_7 ...

Page 4

... NXP Semiconductors Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol P tot Per device amb T stg [ prior to surge. j [2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [3] Reflow soldering is the only recommended soldering method. ...

Page 5

... NXP Semiconductors 7. Characteristics Table unless otherwise specified. amb Symbol Per diode [1] Pulse test: t [2] When switched from I [3] When switched from I BAV70_SER_7 Product data sheet Characteristics Parameter Conditions forward voltage 150 mA F reverse current diode capacitance V R reverse recovery time forward recovery voltage 300 s ...

Page 6

... NXP Semiconductors (mA (1) (2) (3) ( 0.2 0.6 ( 150 C amb ( amb ( amb ( amb Fig 1. Forward current as a function of forward voltage; typical values ( ( ( ( ( 150 C amb ( amb ( amb ( amb Fig 3. Reverse current as a function of reverse voltage; typical values BAV70_SER_7 Product data sheet 006aab107 I FSM 1.0 1 ...

Page 7

... NXP Semiconductors 8. Test information D.U. ( Input signal: reverse pulse rise time t Oscilloscope: rise time Fig 5. Reverse recovery time test circuit and waveforms 450 D.U.T. Input signal: forward pulse rise time t Fig 6. Forward recovery voltage test circuit and waveforms BAV70_SER_7 Product data sheet ...

Page 8

... NXP Semiconductors 9. Package outline 3.0 2.8 3 2.5 1.4 2.1 1.2 1 1.9 Dimensions in mm Fig 7. Package outline BAV70 (SOT23/TO-236AB) 2.2 1 2.2 1.35 2.0 1.15 pin 1 index 1 2 0.65 1.3 Dimensions in mm Fig 9. Package outline BAV70S (SOT363/SC-88) Fig 11. Package outline BAV70W (SOT323/SC-70) BAV70_SER_7 Product data sheet 1 ...

Page 9

... NXP Semiconductors 10. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package BAV70 BAV70M BAV70S BAV70T BAV70W [1] For further information and the availability of packing methods, see [2] T1: normal taping [3] T2: reverse taping 11. Soldering Fig 12. Refl ...

Page 10

... NXP Semiconductors 4.60 Fig 13. Wave soldering footprint BAV70 (SOT23/TO-236AB) Fig 14. Reflow soldering footprint BAV70M (SOT883/SC-101) BAV70_SER_7 Product data sheet 3.40 1.20 (2x) 2 4.00 1.20 3 2.80 4. 0.05 ( 0.90 0. solder lands solder paste Reflow soldering is the only recommended soldering method. ...

Page 11

... NXP Semiconductors Fig 15. Reflow soldering footprint BAV70S (SOT363/SC-88) Dimensions in mm Fig 16. Wave soldering footprint BAV70S (SOT363/SC-88) BAV70_SER_7 Product data sheet 2.35 solder lands 0.50 solder paste (4 ) solder resist 0.50 occupied area (4 ) Dimensions in mm 5.25 4.50 solder lands 1.15 3.75 solder resist ...

Page 12

... NXP Semiconductors Fig 17. Reflow soldering footprint BAV70T (SOT416/SC-75) Fig 18. Reflow soldering footprint BAV70W (SOT323/SC-70) Fig 19. Wave soldering footprint BAV70W (SOT323/SC-70) BAV70_SER_7 Product data sheet 2.0 0.85 0.6 (3x) Dimensions in mm 2.65 0.75 1.325 1. 0.60 2. 2.40 4.60 4.00 1.15 ...

Page 13

... Release date BAV70_SER_7 20071127 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Type number BAV70M added • ...

Page 14

... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...

Page 15

... NXP Semiconductors 15. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 7 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 10 Packing information Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 12 Revision history ...

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