BAW56LT1G ON Semiconductor, BAW56LT1G Datasheet

BAW56LT1G

Manufacturer Part Number

BAW56LT1G

Description

DIODE SWITCH DUAL CA 70V SOT23

Manufacturer

ON Semiconductor

Datasheet

1.BAW56LT3G.pdf (4 pages)

Specifications of BAW56LT1G

Voltage - Forward (vf) (max) @ If

1.25V @ 150mA

Current - Reverse Leakage @ Vr

2.5µA @ 70V

Current - Average Rectified (io) (per Diode)

200mA (DC)

Voltage - Dc Reverse (vr) (max)

70V

Reverse Recovery Time (trr)

6ns

Diode Type

Standard

Speed

Small Signal =< 200mA (Io), Any Speed

Diode Configuration

1 Pair Common Anode

Mounting Type

Surface Mount

Package / Case

SOT-23-3, TO-236-3, Micro3™, SSD3, SST3

Product

Switching Diodes

Peak Reverse Voltage

70 V

Forward Continuous Current

0.2 A

Max Surge Current

4 A

Configuration

Dual Common Anode

Recovery Time

6 ns

Forward Voltage Drop

1.25 V

Maximum Reverse Leakage Current

2.4 uA

Operating Temperature Range

- 55 C to + 150 C

Maximum Operating Temperature

+ 150 C

Minimum Operating Temperature

- 55 C

Mounting Style

SMD/SMT

Rectifier Type

Small Signal Switching Diode

Peak Rep Rev Volt

70V

Avg. Forward Curr (max)

0.2A

Rev Curr

2.5uA

Peak Non-repetitive Surge Current (max)

Forward Voltage

1.25V

Operating Temp Range

-55C to 150C

Package Type

SOT-23

Rev Recov Time

6ns

Operating Temperature Classification

Military

Mounting

Surface Mount

Pin Count

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other names

BAW56LT1GOSTR

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BAW56LT1G

Dual Switching Diode

Common Anode

Features

•

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. FR−5 = 1.0 0.75 0.062 in.

2. Alumina = 0.4 0.3 0.024 in. 99.5% alumina.

3. Square Wave; T

August, 2009 − Rev. 6

MAXIMUM RATINGS

THERMAL CHARACTERISTICS

Reverse Voltage

Forward Current

Peak Forward Surge Current

Non−Repetitive Peak Forward Current

Total Device Dissipation FR− 5 Board

Thermal Resistance,

Total Device Dissipation

Thermal Resistance,

Junction and Storage Temperature

Compliant

These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

t = 1 ms (Note 3)

(Note 1)

Derate above 25°C

Junction−to−Ambient

Alumina Substrate,

(Note 2) T

Derate above 25°C

Junction−to−Ambient

= 25°C

Characteristic

= 25°C

Rating

= 25°C.

(EACH DIODE)

Symbol

FM(surge)

FSM

, T

qJA

stg

−55 to

Value

+150

Max

200

500

225

556

300

417

1.8

2.4

mW/°C

°C/W

Unit

°C

†For information on tape and reel specifications,

BAW56LT1G

BAW56LT3G

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

Device

*Date Code orientation and/or overbar may

vary depending upon manufacturing location.

(Note: Microdot may be in either location)

ANODE

ORDERING INFORMATION

MARKING DIAGRAM

http://onsemi.com

SOT−23 (TO−236)

(Pb−Free)

Package

SOT−23

CASE 318

STYLE 12

= Device Code

= Date Code*

= Pb−Free Package

A1 M G

Publication Order Number:

10,000 / Tape & Reel

3000 / Tape & Reel

Shipping

CATHODE

BAW56LT1/D

†

Related parts for BAW56LT1G

BAW56LT1G Summary of contents

Page 1

... D 1.8 mW/°C R 556 °C/W qJA P 300 mW D 2.4 mW/°C R 417 °C/W qJA −55 to °C J stg +150 BAW56LT1G BAW56LT3G †For information on tape and reel specifications, 1 http://onsemi.com CATHODE 1 ANODE 3 2 CATHODE SOT−23 (TO−236) CASE 318 STYLE 12 MARKING DIAGRAM Device Code M = Date Code Pb− ...

Page 2

ELECTRICAL CHARACTERISTICS Characteristic Reverse Breakdown Voltage Reverse Voltage Leakage Current Diode Capacitance Forward Voltage Reverse Recovery Time ( mA 1.0 mA) (Figure R(REC) 820 W + 100 ...

Page 3

T = 85° 1 25°C A 0.1 0.2 0.4 0.6 0 FORWARD VOLTAGE (VOLTS) F Figure 2. Forward Voltage 1.75 1.5 1.25 1.0 0.75 0 Curves Applicable to Each Cathode 10 1.0 T ...

Page 4

... A A1 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “ ...

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