IRF6637TR1PBF International Rectifier, IRF6637TR1PBF Datasheet - Page 3
![MOSFET N-CH 30V 14A DIRECTFET](/photos/5/49/54944/irf6637tr1pbf_sml.jpg)
IRF6637TR1PBF
Manufacturer Part Number
IRF6637TR1PBF
Description
MOSFET N-CH 30V 14A DIRECTFET
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheet
1.IRF6637TR1PBF.pdf
(10 pages)
Specifications of IRF6637TR1PBF
Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
7.7 mOhm @ 14A, 10V
Drain To Source Voltage (vdss)
30V
Current - Continuous Drain (id) @ 25° C
14A
Vgs(th) (max) @ Id
2.35V @ 250µA
Gate Charge (qg) @ Vgs
17nC @ 4.5V
Input Capacitance (ciss) @ Vds
1330pF @ 15V
Power - Max
2.3W
Mounting Type
Surface Mount
Package / Case
DirectFET™ Isometric MP
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
10.8 mOhms
Drain-source Breakdown Voltage
30 V
Gate-source Breakdown Voltage
20 V
Continuous Drain Current
14 A
Power Dissipation
89 W
Gate Charge Qg
11 nC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
IRF6637TR1PBFTR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
IRF6637TR1PBF
Manufacturer:
SHARP
Quantity:
3 000
Surface mounted on 1 in. square Cu
board (still air).
Notes:
P
P
P
T
T
T
R
R
R
R
R
Absolute Maximum Ratings
Thermal Resistance
www.irf.com
P
J
STG
D
D
D
θJA
θJA
θJA
θJC
θJ-PCB
Surface mounted on 1 in. square Cu board, steady state.
Used double sided cooling, mounting pad with large heatsink.
T
@T
@T
@T
C
measured with thermocouple incontact with top (Drain) of part.
A
A
C
= 25°C
= 70°C
= 25°C
0.01
100
0.1
10
1
1E-006
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
D = 0.50
0.05
0.02
0.01
0.20
0.10
Power Dissipation
Power Dissipation
Power Dissipation
Peak Soldering Temperature
Operating Junction and
Storage Temperature Range
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Case
Junction-to-PCB Mounted
Linear Derating Factor
1E-005
SINGLE PULSE
( THERMAL RESPONSE )
0.0001
fl
f
jl
kl
l
Parameter
Parameter
Ã
t 1 , Rectangular Pulse Duration (sec)
0.001
small clip heatsink (still air)
τ
J
τ
J
τ
1
Ci= τi/Ri
τ
1
Ci= τi/Ri
back and with small clip heatsink.
0.01
Mounted on minimum footprint full size board with metalized
R
R
θ
1
R
is measured at
1
τ
2
τ
R
2
2
R
2
R
τ
0.1
with
3
3
R
τ
3
3
τ
J
R
4
τ
Typ.
4
R
12.5
4
–––
–––
1.0
4
20
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
R
τ
5
5
R
τ
-40 to + 150
5
5
1
τ
τ
C
Max.
0.018
τ
footprint full size board with
metalized back and with small
clip heatsink (still air)
Mounted on minimum
270
2.3
1.5
42
Ri (°C/W)
0.6676
1.0462
1.5611
29.282
25.455
IRF6637PbF
Max.
10
–––
–––
–––
3.0
55
0.000066
0.000896
0.004386
0.68618
32
τi (sec)
100
Units
Units
°C/W
W/°C
°C
W
3