IRF6713STR1PBF International Rectifier, IRF6713STR1PBF Datasheet - Page 3

• Manufacturer Part Number: IRF6713STR1PBF
• Description: MOSFET N-CH 25V 22A DIRECTFET
• Manufacturer: International Rectifier
• Series: HEXFET®r

Specifications of IRF6713STR1PBF

• Fet Type: MOSFET N-Channel, Metal Oxide
• Fet Feature: Logic Level Gate
• Rds On (max) @ Id, Vgs: 3 mOhm @ 22A, 10V
• Drain To Source Voltage (vdss): 25V
• Current - Continuous Drain (id) @ 25° C: 22A
• Vgs(th) (max) @ Id: 2.4V @ 50µA
• Gate Charge (qg) @ Vgs: 32nC @ 4.5V
• Input Capacitance (ciss) @ Vds: 2880pF @ 13V
• Power - Max: 2.2W
• Mounting Type: Surface Mount
• Package / Case: DirectFET™ Isometric SQ
• Transistor Polarity: N-Channel
• Resistance Drain-source Rds (on): 4.6 mOhms
• Drain-source Breakdown Voltage: 25 V
• Gate-source Breakdown Voltage: 20 V
• Continuous Drain Current: 95 A
• Power Dissipation: 42 W
• Gate Charge Qg: 21 nC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: IRF6713STR1PBFTR

ˆ
‰
Notes:
P
P
P
T
T
T
R
R
R
R
R
Absolute Maximum Ratings
Thermal Resistance
ƒ Surface mounted on 1 in. square Cu
www.irf.com
P
J
STG
D
D
D
θJA
θJA
θJA
θJC
θJ-PCB
back and with small clip heatsink.
Used double sided cooling , mounting pad with large heatsink.
Mounted on minimum footprint full size board with metalized
(still air).
@T
@T
@T
A
A
C
= 25°C
= 70°C
= 25°C
0.001
0.01
100
0.1
10
1E-006
1
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
D = 0.50
0.20
0.10
0.05
0.02
0.01
Power Dissipation
Power Dissipation
Power Dissipation
Peak Soldering Temperature
Operating Junction and
Storage Temperature Range
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Case
Junction-to-PCB Mounted
Linear Derating Factor
1E-005
SINGLE PULSE
( THERMAL RESPONSE )
0.0001
fl
f
jl
kl
l
Parameter
Parameter
Ã
0.001
t 1 , Rectangular Pulse Duration (sec)
‰
small clip heatsink (still air)
τ
J
0.01
τ
J
τ
1
Ci= τi/Ri
τ
Š
1
Ci= τi/Ri
R
θ
R
1
R
is measured at
1
0.1
τ
2
R
τ
2
2
R
2
with
R
τ
3
3
R
τ
3
3
1
J
Typ.
12.5
–––
–––
1.0
20
τ
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
R
4
τ
4
R
4
4
-40 to + 150
τ
A
τ
A
Max.
0.017
footprint full size board with
metalized back and with small
clip heatsink (still air)
10
‰ Mounted on minimum
270
Ri (°C/W)
2.2
1.4
42
1.6173
13.743
23.749
18.890
Max.
ƒ
–––
–––
–––
3.0
58
100
0.000361
0.126662
1.3404
51
τi (sec)
1000
Units
Units
°C/W
W/°C
°C
W
3