NTB35N15G ON Semiconductor, NTB35N15G Datasheet

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NTB35N15G

Manufacturer Part Number
NTB35N15G
Description
MOSFET N-CH 150V 37A D2PAK
Manufacturer
ON Semiconductor
Datasheet

Specifications of NTB35N15G

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
50 mOhm @ 18.5A, 10V
Drain To Source Voltage (vdss)
150V
Current - Continuous Drain (id) @ 25° C
37A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
100nC @ 10V
Input Capacitance (ciss) @ Vds
3200pF @ 25V
Power - Max
2W
Mounting Type
Surface Mount
Package / Case
D²Pak, TO-263 (2 leads + tab)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NTB35N15G
Manufacturer:
ON
Quantity:
12 500
NTB35N15
Power MOSFET
37 Amps, 150 Volts
N−Channel Enhancement−Mode D
Features
Typical Applications
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. When surface mounted to an FR4 board using the minimum recommended
2. Pulse Test: Pulse Width = 10 ms, Duty Cycle = 2%.
MAXIMUM RATINGS
© Semiconductor Components Industries, LLC, 2005
August, 2005 − Rev. 5
Drain−to−Source Voltage
Drain−to−Source Voltage (R
Gate−to−Source Voltage
Drain Current
Total Power Dissipation @ T
Derate above 25°C
Total Power Dissipation @ T
Operating and Storage Temperature Range
Single Pulse Drain−to−Source Avalanche
Energy − Starting T
(V
I
Thermal Resistance
Maximum Lead Temperature for Soldering
Purposes, 1/8 in from case for 10 seconds
L(pk)
Fast Recovery Diode
Source−to−Drain Diode Recovery Time Comparable to a Discrete
Avalanche Energy Specified
I
Mounting Information Provided for the D
Pb−Free Packages are Available
PWM Motor Controls
Power Supplies
Converters
pad size, (Cu. Area 0.412 in
DD
DSS
= 21.6 A, L = 3.0 mH, R
= 100 Vdc, V
and R
DS(on)
− Junction−to−Case
− Junction−to−Ambient
− Junction−to−Ambient (Note 1)
− Continuous @ T
− Continuous @ T
− Pulsed (Note 2)
− Continuous
− Non−Repetitive (t
GS
J
Rating
Specified at Elevated Temperature
= 25°C
= 10 Vdc,
(T
J
= 25°C unless otherwise noted)
GS
A
A
G
2
= 25°C
= 25°C (Note 1)
).
= 1.0 MW)
= 25 W)
A
A
= 25°C
= 100°C
p
v10 ms)
2
PAK Package
Symbol
T
V
V
V
R
R
R
J
V
E
I
GSM
P
DGR
, T
T
DSS
I
I
DM
qJC
qJA
qJA
GS
D
D
AS
D
L
stg
−55 to
Value
+150
"20
"40
1.43
62.5
150
150
178
700
260
2
111
2.0
0.7
37
23
50
PAK
1
W/°C
°C/W
Unit
Vdc
Vdc
Vdc
Adc
mJ
°C
°C
W
W
NTB35N15
NTB35N15G
NTB35N15T4
NTB35N15T4G
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
1
Device
CASE 418B
37 AMPERES, 150 VOLTS
2
STYLE 2
D
3
2
35N15
A
Y
WW
G
50 mW @ V
ORDERING INFORMATION
PAK
G
http://onsemi.com
4
= Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
N−Channel
(Pb−Free)
(Pb−Free)
Package
D
D
D
D
2
2
2
2
D
PAK
PAK
PAK
PAK
Publication Order Number:
MARKING DIAGRAM
& PIN ASSIGNMENT
Gate
GS
S
1
= 10 V
35N15G
AYWW
Drain
Drain
800 Tape & Reel
800 Tape & Reel
4
2
50 Units/Rail
50 Units/Rail
Shipping
NTB35N15/D
3
Source

Related parts for NTB35N15G

NTB35N15G Summary of contents

Page 1

... AS °C/W Device R 0.7 qJC R 62.5 qJA NTB35N15 50 R qJA NTB35N15G °C T 260 L NTB35N15T4 NTB35N15T4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 1 http://onsemi.com 37 AMPERES, 150 VOLTS ...

Page 2

ELECTRICAL CHARACTERISTICS Characteristic OFF CHARACTERISTICS Drain−to−Source Breakdown Voltage = 250 mAdc Vdc Temperature Coefficient (Positive) Zero Gate Voltage Drain Current ( Vdc 150 Vdc 25° ...

Page 3

5 ...

Page 4

Switching behavior is most easily modeled and predicted by recognizing that the power MOSFET is charge controlled. The lengths of various switching intervals (Dt) are determined by how fast the FET input capacitance can be charged by current from the ...

Page 5

TOTAL GATE CHARGE (nC) G Figure 8. Gate−To−Source and Drain−To−Source Voltage versus Total Charge DRAIN−TO−SOURCE DIODE CHARACTERISTICS 40 ...

Page 6

SINGLE PULSE T = 25°C C 100 LIMIT DS(on) THERMAL LIMIT PACKAGE LIMIT 0.1 0.1 1 DRAIN−TO−SOURCE VOLTAGE (VOLTS) DS Figure 11. Maximum Rated Forward Biased Safe Operating ...

Page 7

... PL 0.13 (0.005 VARIABLE CONFIGURATION ZONE VIEW W−W VIEW W−W 1 10.66 0.42 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NTB35N15 PACKAGE DIMENSIONS 2 D PAK CASE 418B−04 ISSUE ...

Page 8

... Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com NTB35N15 N. American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 8 ON Semiconductor Website: http://onsemi ...

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