SSM2019BNZ Analog Devices Inc, SSM2019BNZ Datasheet - Page 8

• Manufacturer Part Number: SSM2019BNZ
• Description: Audio Amp Microphone 1-CH Mono Class-AB 8-Pin PDIP
• Manufacturer: Analog Devices Inc
• Type: Class ABr

Specifications of SSM2019BNZ

• Package: 8PDIP
• Function: Microphone
• Amplifier Type: Class-AB
• Input Signal Type: Differential
• Typical Voltage Gain: 70 dB
• Total Harmonic Distortion Noise: 0.0035@2000Ohm %
• Typical Psrr: 124 dB
• Output Signal Type: Single
• Maximum Input Bias Current: 3(Typ)@±15V uA
• Maximum Input Offset Voltage: 0.05(Typ)@±15V mV
• Maximum Load Resistance: 2000 Ohm
• Output Type: 1-Channel Mono
• Voltage - Supply: 10 V ~ 36 V, ±5 V ~ 18 V
• Features: Differential Inputs
• Mounting Type: Through Hole
• Package / Case: 8-DIP (0.300", 7.62mm)
• Bandwidth: 200 kHz
• Common Mode Rejection Ratio: 130
• Current, Input Bias: 3 μA
• Current, Input Offset: ±0.001 μA
• Current, Supply: ±4.7 mA
• Harmonic Distortion: 0.017 %
• Impedance, Thermal: 96 °C/W
• Package Type: PDIP-8
• Resistance, Input: 5.3 Megohms
• Slew Rate: 16
• Temperature, Operating, Range: -40 to +85 °C
• Voltage, Input: ±12 V
• Voltage, Input Offset: 0.05 mV
• Voltage, Noise: 1 nV/sqrt Hz
• Voltage, Output Swing: ±13.9 V
• Voltage, Supply: ±5 to ±18 V
• Amplifier Class: AB
• No. Of Channels: 1
• Supply Voltage Range: ± 5V To ± 18V
• Load Impedance: 2kohm
• Operating Temperature Range: -40°C To +85°C
• Amplifier Case Style: DIP
• No. Of Pins: 8
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Max Output Power X Channels @ Load: -
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

SSM2019
BUS SUMMING AMPLIFIER
In addition to its use as a microphone preamplifier, the SSM2019
can be used as a very low noise summing amplifier. Such a circuit
is particularly useful when many medium impedance outputs
are summed together to produce a high effective noise gain.
The principle of the summing amplifier is to ground the SSM2019
inputs. Under these conditions, Pins 1 and 8 are ac virtual grounds
sitting about 0.55 V below ground. To remove the 0.55 V offset,
the circuit of Figure 5 is recommended.
A2 forms a “servo” amplifier feeding the SSM2019 inputs. This
places Pins l and 8 at a true dc virtual ground. R4 in conjunction
with C2 removes the voltage noise of A2, and in fact just about
any operational amplifier will work well here since it is removed
from the signal path. If the dc offset at Pins l and 8 is not too
0.150 (3.81)
0.130 (3.30)
0.110 (2.79)
0.022 (0.56)
0.018 (0.46)
0.014 (0.36)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
(4.57)
0.180
MAX
8-Lead Plastic Dual In-Line Package [PDIP]
Dimensions shown in inches and (millimeters)
8
1
COMPLIANT TO JEDEC STANDARDS MO-095AA
0.100 (2.54)
0.375 (9.53)
0.365 (9.27)
0.355 (9.02)
BSC
5
4
0.060 (1.52)
0.050 (1.27)
0.045 (1.14)
0.295 (7.49)
0.285 (7.24)
0.275 (6.98)
SEATING
PLANE
0.015
(0.38)
MIN
(N-8)
COPLANARITY
0.25 (0.0098)
0.10 (0.0040)
0.325 (8.26)
0.310 (7.87)
0.300 (7.62)
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
8-Lead Standard Small Outline Package [SOIC]*
4.00 (0.1574)
3.80 (0.1497)
0.10
Dimensions shown in millimeters and (inches)
COMPLIANT TO JEDEC STANDARDS MS-012AA
SEATING
0.015 (0.38)
0.010 (0.25)
0.008 (0.20)
5.00 (0.1968)
4.80 (0.1890)
1.27 (0.0500)
PLANE
0.150 (3.81)
0.135 (3.43)
0.120 (3.05)
8
1
OUTLINE DIMENSIONS
*Consult factory for availability.
BSC
0.51 (0.0201)
0.33 (0.0130)
5
4
Narrow Body
6.20 (0.2440)
5.80 (0.2284)
(RN-8)
1.75 (0.0688)
1.35 (0.0532)
–8–
critical, then the servo loop can be replaced by the diode biasing
scheme of Figure 5. If ac coupling is used throughout, then Pins 2
and 3 may be directly grounded.
0.30 (0.0118)
0.10 (0.0039)
0.25 (0.0098)
0.19 (0.0075)
COPLANARITY
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
16-Lead Standard Small Outline Package [SOIC]
0.10
+ IN
– IN
6.2k
8
0
COMPLIANT TO JEDEC STANDARDS MS-013AA
0.50 (0.0196)
0.25 (0.0099)
R2
Dimensions shown in millimeters and (inches)
16
1
Figure 5. Bus Summing Amplifier
1.27 (0.0500)
0.41 (0.0160)
1.27 (0.0500)
10.50 (0.4134)
10.10 (0.3976)
BSC
0.51 (0.0201)
0.33 (0.0130)
0.33 F
C1
A2
33k
R3
45
Wide Body
9
8
(RW-16)
SEATING
PLANE
5.1k
R4
7.60 (0.2992)
7.40 (0.2913)
2.65 (0.1043)
2.35 (0.0925)
C2
200 F
10.65 (0.4193)
10.00 (0.3937)
0.32 (0.0126)
0.23 (0.0091)
SSM2019
TO PINS
2 AND 3
IN4148
8
0
0.75 (0.0295)
0.25 (0.0098)
V
R5
10k
V
OUT
1.27 (0.0500)
0.40 (0.0157)
REV. 0
45