HSMS-2822-TR1G Avago Technologies US Inc., HSMS-2822-TR1G Datasheet - Page 2

• Manufacturer Part Number: HSMS-2822-TR1G
• Description: DIODE SCHOTTKY RF SER 15V SOT-23
• Manufacturer: Avago Technologies US Inc.

Specifications of HSMS-2822-TR1G

• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Diode Type: Schottky - 1 Pair Series Connection
• Voltage - Peak Reverse (max): 15V
• Current - Max: 1A
• Capacitance @ Vr, F: 1pF @ 0V, 1MHz
• Resistance @ If, F: 12 Ohm @ 5mA, 1MHz
• Product: Schottky Diodes
• Peak Reverse Voltage: 15 V
• Forward Continuous Current: 1 A
• Configuration: Dual Series
• Forward Voltage Drop: 0.5 V @ 0.01 A
• Maximum Reverse Leakage Current: 0.1 uA @ 1 V
• Operating Temperature Range: + 150 C
• Mounting Style: SMD/SMT
• Capacitance Ct: 1pF
• Diode Case Style: SOT-23
• No. Of Pins: 3
• Breakdown Voltage: 15V
• Forward Voltage: 340mV
• Leaded Process Compatible: Yes
• Rohs Compliant: Yes
• Forward Current If Max: 1A
• Forward Voltage Vf Max: 340mV
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power Dissipation (max): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 516-1818-2; HSMS-2822-TR1G

Notes:
1. Package marking provides orientation and identification.
2. See “Electrical Specifications” for appropriate package marking.
Absolute Maximum Ratings
Notes:
1. Operation in excess of any one of these conditions may result in permanent damage to the device.
2. T
Electrical Specifications T
Notes:
1. ∆V
2. ∆C
3. Effective Carrier Lifetime (τ) for all these diodes is 100 ps maximum measured with Krakauer method at 5 mA.
4. See section titled “Quad Capacitance. ”
5. R
2
1
2
3
Pin Connections and Package Marking
Symbol
I
P
T
T
θ
Number Marking Lead
f
HSMS
Test Conditions
stg
j
282M
IV
jc
282N
2820
2822
2823
2824
2825
2827
2828
2829
282B
282C
282K
282P
282R
282E
282F
282L
Part
D
C
= R
F
TO
= +25°C, where T
for diodes in pairs and quads in 15 mV maximum at 1 mA.
for diodes in pairs and quads is 0.2 pF maximum.
[4]
S
+ 5.2Ω at 25°C and I
Package
Code
HH
NN
OO
C0
C2
C3
C4
C5
C7
C8
C9
C0
C2
C3
C4
CK
CL
CP
Parameter
Forward Current (1 μs Pulse)
Peak Inverse Voltage
Junction Temperature
Storage Temperature
Thermal Resistance
C
is defined to be the temperature at the package pins where contact is made to the circuit board.
Code Configuration
M
B
C
K
N
R
0
2
3
4
5
7
8
9
E
F
L
P
6
5
4
C
f
= 25°C, Single Diode
= 5 mA.
[1]
Single
Series
Common Anode
Common Cathode
Unconnected Pair
Ring Quad
Bridge Quad
Cross‑over Quad
Single
Series
Common Anode
Unconnected Pair
Common Cathode
High Isolation
Unconnected Trio
Common Cathode Quad
Common Anode Quad
Bridge Quad
Ring Quad
T
C
= 25°C
[2]
[4]
[4]
[3]
I
Breakdown
R
Minimum
Voltage
= 100 mA
V
BR
Unit
Amp
V
°C
°C
°C/W
15
(V)
I
Maximum
F
Forward
Voltage
= 1 mA
V
F
340
(mV)
[1]
Maximum Maximum
0.5
Forward
Voltage
V
I
SOT-23/SOT-143
1
15
150
‑65 to 150
500
F
F
(mA)
(V) @
10
100
Leakage
I
Reverse
R
V
(nA) @
R
(V)
1
Capacitance
f = 1 MHz
Maximum
V
SOT-323/SOT-363
1
15
150
‑65 to 150
150
C
R
T
1.0
= 0V
(pF)
[2]
Resistance
I
Dynamic
F
Typical
R
= 5 mA
D
12
(Ω)
[5]