BAP50-04,215 NXP Semiconductors, BAP50-04,215 Datasheet - Page 3

DIODE PIN GP 50V 50MA SOT-23

BAP50-04,215

Manufacturer Part Number
BAP50-04,215
Description
DIODE PIN GP 50V 50MA SOT-23
Manufacturer
NXP Semiconductors
Series
-r
Datasheet

Specifications of BAP50-04,215

Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Diode Type
PIN - 1 Pair Series Connection
Voltage - Peak Reverse (max)
50V
Current - Max
50mA
Capacitance @ Vr, F
0.5pF @ 5V, 1MHz
Resistance @ If, F
5 Ohm @ 10mA, 100MHz
Power Dissipation (max)
250mW
Configuration
Dual Series
Reverse Voltage
50 V
Forward Continuous Current
50 mA
Carrier Life
1.05 us
Forward Voltage Drop
1.1 V
Maximum Diode Capacitance
0.5 pF at 5 V
Maximum Operating Temperature
+ 150 C
Maximum Series Resistance @ Maximum If
5 Ohms at 10 mA
Maximum Series Resistance @ Minimum If
40 Ohms at 0.5 mA
Minimum Operating Temperature
- 65 C
Mounting Style
SMD/SMT
Power Dissipation
250 mW
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-1917-2
934055687215
BAP50-04 T/R
NXP Semiconductors
ELECTRICAL CHARACTERISTICS
T
Note
1. Guaranteed on AQL basis: inspection level S4, AQL 1.0.
THERMAL CHARACTERISTICS
1999 Dec 03
Per diode
V
V
I
C
r
L
R
j
SYMBOL
R
SYMBOL
D
L
S
= 25 C unless otherwise specified.
F
R
General purpose PIN diode
d
th j-s
forward voltage
reverse voltage
reverse current
diode capacitance
diode forward resistance
charge carrier life time
series inductance
thermal resistance from junction to soldering point
PARAMETER
I
I
V
V
V
V
I
I
I
when switched from I
R
PARAMETER
F
R
F
F
F
R
R
R
R
L
= 50 mA
= 0.5 mA; f = 100 MHz; note 1
= 1 mA; f = 100 MHz; note 1
= 10 mA; f = 100 MHz; note 1
= 10 A
100 ; measured at I
= 50 V
= 0; f = 1 MHz
= 1 V; f = 1 MHz
= 5 V; f = 1 MHz
CONDITIONS
3
F
10 mA to I
R
3 mA
R
6 mA;
50
MIN.
VALUE
220
0.95
0.45
0.35
0.3
25
14
3
1.05
1.4
TYP.
Product specification
BAP50-04
1.1
100
0.6
0.5
40
25
5
MAX. UNIT
UNIT
K/W
V
V
nA
pF
pF
pF
s
nH

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