HSMP-3830-TR2G Avago Technologies US Inc., HSMP-3830-TR2G Datasheet - Page 6

DIODE PIN GP 200V SOT-23

HSMP-3830-TR2G

Manufacturer Part Number
HSMP-3830-TR2G
Description
DIODE PIN GP 200V SOT-23
Manufacturer
Avago Technologies US Inc.
Type
Attenuator/Switchr
Datasheet

Specifications of HSMP-3830-TR2G

Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Diode Type
PIN - Single
Voltage - Peak Reverse (max)
200V
Current - Max
1A
Capacitance @ Vr, F
0.3pF @ 50V, 1MHz
Resistance @ If, F
1.5 Ohm @ 100mA, 100MHz
Power Dissipation (max)
250mW
Configuration
Single
Reverse Voltage
50 V
Forward Continuous Current
1 A
Termination Style
SMD/SMT
Carrier Life
0.5 us
Maximum Diode Capacitance
0.3 pF at 50 V
Maximum Operating Temperature
+ 150 C
Maximum Series Resistance @ Maximum If
1.5 Ohms at 100 mA
Maximum Series Resistance @ Minimum If
20 Ohms at 1 mA
Minimum Operating Temperature
- 65 C
Mounting Style
SMD/SMT
Power Dissipation
250 mW
Recovery Time
80 ns
Operating Temperature Classification
Military
Package Type
SOT-23
Mounting
Surface Mount
Operating Temperature (max)
150C
Operating Temperature (min)
-65C
Pin Count
3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HSMP-3830-TR2G
Manufacturer:
AVAGO
Quantity:
40 000
Part Number:
HSMP-3830-TR2G
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Package Dimensions
Outline 23 (SOT-23)
Package Characteristics
Lead Material .............................................................................................................................Alloy 42
Lead Finish ..........................................................................................Tin 100% (Lead-free option)
Maximum Soldering Temperature ............................................................. 260°C for 5 seconds
Minimum Lead Strength . ........................................................................................... 2 pounds pull
Typical Package Inductance ....................................................................................................... 2 nH
Typical Package Capacitance ...............................................................0.08 pF (opposite leads)
Profile Option Descriptions
-BLKG = Bulk
-TR1G = 3K pc. Tape and Reel, Device Orientation; See Figure 13
-TR2G = 10K pc. Tape and Reel, Device Orientation; See Figure 13
Tape and Reeling conforms to Electronic Industries RS-481, “Taping of Surface
Mounted Components for Automated Placement. ”
Ordering Information
Specify part number followed by option. For example:
HSMP - 383x - XXX
6
E
A1
Notes:
XXX-package marking
Drawings are not to scale
e2
e
XXX
e1
D
B
E1
A
Bulk or Tape and Reel Option
Part Number
Surface Mount PIN Diode
SYMBOL
A1
E1
e1
e2
B
D
A
C
e
E
L
0.000
DIMENSIONS (mm)
MIN.
0.79
0.30
0.08
2.73
1.15
0.89
1.78
0.45
2.10
0.45
C
0.100
MAX.
1.20
0.54
0.20
3.13
1.50
1.02
2.04
0.60
2.70
0.69
L
Recommended PCB Pad Layout
for Avago’s SOT-23 Products
0.039
0.035
1
0.9
Dimensions in inches
0.031
0.8
0.039
mm
1
0.079
2.0

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