SI8236AA-C-IM Silicon Laboratories Inc, SI8236AA-C-IM Datasheet - Page 41
SI8236AA-C-IM
Manufacturer Part Number
SI8236AA-C-IM
Description
MOSFET DRVR 4A 2-OUT Half Brdg Non-Inv 14-Pin LGA
Manufacturer
Silicon Laboratories Inc
Datasheet
1.SI8234BB-C-IS1.pdf
(52 pages)
Specifications of SI8236AA-C-IM
Package
14LGA
Driver Configuration
Non-Inverting
Peak Output Current
4 A
Input Logic Compatibility
TTL
Number Of Outputs
2
Output Resistance
2.7 Ohm
Maximum Rise Time
20 ns
Maximum Power Dissipation
1200 mW
Maximum Supply Current
2.5(Typ) mA
Operating Temperature
-40 to 125 °C
Configuration
Low-Side
Input Type
Non-Inverting
Delay Time
60ns
Current - Peak
4A
Number Of Configurations
2
Voltage - Supply
6.5 V ~ 24 V
Mounting Type
Surface Mount
Package / Case
14-VFLGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
High Side Voltage - Max (bootstrap)
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
SI8236AA-C-IMR
Manufacturer:
SILICON
Quantity:
500
9. Package Outline: 16-Pin Narrow Body SOIC
Figure 46 illustrates the package details for the Si823x in a 16-pin narrow-body SOIC (SO-16). Table 20 lists the
values for the dimensions shown in the illustration.
Notes:
Dimension
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This drawing conforms to the JEDEC Solid State Outline MS-012, Variation AC.
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body
A1
A2
E1
Components.
A
D
E
b
c
e
Figure 46. 16-pin Small Outline Integrated Circuit (SOIC) Package
0.10
1.25
0.31
0.17
Min
—
9.90 BSC
6.00 BSC
3.90 BSC
1.27 BSC
Table 20. Package Diagram Dimensions
Max
1.75
0.25
0.51
0.25
—
Rev. 1.1
Dimension
aaa
bbb
ddd
ccc
L2
L
h
θ
0.40
0.25
Min
0°
0.25 BSC
0.10
0.20
0.10
0.25
Max
1.27
0.50
Si823x
8°
41