XC3S400-4FTG256C Xilinx Inc, XC3S400-4FTG256C Datasheet - Page 118

FPGA Spartan®-3 Family 400K Gates 8064 Cells 630MHz 90nm Technology 1.2V 256-Pin FTBGA

XC3S400-4FTG256C

Manufacturer Part Number
XC3S400-4FTG256C
Description
FPGA Spartan®-3 Family 400K Gates 8064 Cells 630MHz 90nm Technology 1.2V 256-Pin FTBGA
Manufacturer
Xilinx Inc
Series
Spartan™-3r
Datasheet

Specifications of XC3S400-4FTG256C

Package
256FTBGA
Family Name
Spartan®-3
Device Logic Units
8064
Device System Gates
400000
Maximum Internal Frequency
630 MHz
Typical Operating Supply Voltage
1.2 V
Maximum Number Of User I/os
173
Ram Bits
294912
Number Of Logic Elements/cells
8064
Number Of Labs/clbs
896
Total Ram Bits
294912
Number Of I /o
173
Number Of Gates
400000
Voltage - Supply
1.14 V ~ 1.26 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
256-LBGA
Dc
0837
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
122-1342

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
XC3S400-4FTG256C
Manufacturer:
XILINX61
Quantity:
150
Part Number:
XC3S400-4FTG256C
Manufacturer:
Xilinx Inc
Quantity:
10 000
Part Number:
XC3S400-4FTG256C
Manufacturer:
XILINX
Quantity:
1 000
Part Number:
XC3S400-4FTG256C
Manufacturer:
XILINX
Quantity:
1 000
Part Number:
XC3S400-4FTG256C
Manufacturer:
XILINX
0
Part Number:
XC3S400-4FTG256C
Manufacturer:
XILINX
Quantity:
20 000
Part Number:
XC3S400-4FTG256C
0
Company:
Part Number:
XC3S400-4FTG256C
Quantity:
1 500
Spartan-3 FPGA Family: Pinout Descriptions
Table 79: Bitstream Options Affecting Spartan-3 Pins (Continued)
Setting Bitstream Generator Options
Refer to the
documentation.
118
M0
HSWAP_EN
TDI
TMS
TCK
TDO
Affected Pin
Name(s)
“BitGen” chapter
After configuration, this bitstream option either pulls M0 to
VCCAUX via a pull-up resistor, to ground via a pull-down resistor,
or allows M0 to float.
After configuration, this bitstream option either pulls HSWAP_EN
to VCCAUX via a pull-up resistor, to ground via a pull-down
resistor, or allows HSWAP_EN to float.
After configuration, this bitstream option either pulls TDI to
VCCAUX via a pull-up resistor, to ground via a pull-down resistor,
or allows TDI to float.
After configuration, this bitstream option either pulls TMS to
VCCAUX via a pull-up resistor, to ground via a pull-down resistor,
or allows TMS to float.
After configuration, this bitstream option either pulls TCK to
VCCAUX via a pull-up resistor, to ground via a pull-down resistor,
or allows TCK to float.
After configuration, this bitstream option either pulls TDO to
VCCAUX via a pull-up resistor, to ground via a pull-down resistor,
or allows TDO to float.
in the Xilinx ISE
Bitstream Generation Function
®
software
www.xilinx.com
DS099-4 (v2.5) December 4, 2009
HswapenPin •
Variable
TmsPin
Option
TdoPin
TckPin
M0Pin
TdiPin
Name
Product Specification
(default
Values
Pullup
Pulldown
Pullnone
Pullup
Pulldown
Pullnone
Pullup
Pulldown
Pullnone
Pullup
Pulldown
Pullnone
Pullup
Pulldown
Pullnone
Pullup
Pulldown
Pullnone
value)
R

Related parts for XC3S400-4FTG256C