BCP68T1G
NPN Silicon
Epitaxial Transistor
voltage, high current applications. The device is housed in the
SOT- -223 package, which is designed for medium power surface
mount applications.
Features
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Device mounted on a glass epoxy printed circuit board 1.575 in. x 1.575 in.
Semiconductor Components Industries, LLC, 2010
September, 2010 - - Rev. 6
MAXIMUM RATINGS
THERMAL CHARACTERISTICS
Collector--Emitter Voltage
Collector--Base Voltage
Emitter--Base Voltage
Collector Current
Total Power Dissipation @ T
(Note 1)
Derate above 25C
Operating and Storage Temperature
Range
Thermal Resistance,
Junction--to--Ambient (Surface Mounted)
Lead Temperature for Soldering,
0.0625 in from case
Time in Solder Bath
This NPN Silicon Epitaxial Transistor is designed for use in low
thermal conduction, and allows visual inspection of soldered joints.
The formed leads absorb thermal stress during soldering, eliminating
the possibility of damage to the die
Compliant
High Current: I
The SOT- -223 Package Can Be Soldered Using Wave or Reflow
SOT- -223 package ensures level mounting, resulting in improved
The PNP Complement is BCP69T1
These Devices are Pb- -Free, Halogen Free/BFR Free and are RoHS
x 0.059 in.; mounting pad for the collector lead min. 0.93 sq. in.
Characteristic
Rating
C
= 1.0 A
(T
C
A
= 25C unless otherwise noted)
= 25C
Symbol
Symbol
T
V
V
V
R
J
P
CEO
CBO
, T
EBO
T
I
θJA
C
D
L
stg
-- 65 to 150
Value
Max
83.3
260
5.0
1.0
1.5
20
25
12
10
1
mW/C
C/W
Unit
Unit
Vdc
Vdc
Vdc
Adc
Sec
C
C
W
†For information on tape and reel specifications,
BCP68T1G
BCP68T3G
MEDIUM POWER NPN SILICON
1
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
HIGH CURRENT TRANSISTOR
Device
2
(Note: Microdot may be in either location)
3
ORDERING INFORMATION
CA = Specific Device Code
A
Y
W
G
SURFACE MOUNT
BASE
4
http://onsemi.com
COLLECTOR 2,4
= Assembly Location
= Year
= Work Week
= Pb--Free Package
1
(Pb--Free)
(Pb--Free)
SOT--223
SOT--223
Package
CASE 318E
SOT- -223
STYLE 1
EMITTER 3
Publication Order Number:
1000/Tape & Reel
4000/Tape & Reel
Shipping
MARKING
DIAGRAM
BCP68T1/D
AYW
CA G
G
†