MAX19790ETX+T Maxim Integrated Products, MAX19790ETX+T Datasheet - Page 10
![no-image](/images/manufacturer_photos/0/4/417/maxim_integrated_products_sml.jpg)
MAX19790ETX+T
Manufacturer Part Number
MAX19790ETX+T
Description
Active Attenuator 250MHz to 4000MHz Du al, Analog Voltage V
Manufacturer
Maxim Integrated Products
Datasheet
1.MAX19790ETX.pdf
(11 pages)
Specifications of MAX19790ETX+T
Mounting Style
SMD/SMT
Package / Case
QFN-36
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
250MHz to 4000MHz Dual,
Analog Voltage Variable Attenuator
The exposed pad (EP) of the device’s 36-pin thin QFN
package provides a low thermal-resistance path to
the die. It is important that the PCB on which the IC is
mounted be designed to conduct heat from this contact.
In addition, provide the EP with a low-inductance RF
ground path for the device.
10
V
CC
Exposed Pad RF and Thermal
C4
C5
RFOUT
R2
RFB*
*SCHEMATIC SHOWS CONFIGURATION FOR TWO CASCADED ATTENUATORS. TO USE ATTENUATOR A ONLY MOVE C3
TO CONNECT OUT_A TO RFB. TO USE ATTENUATOR B ONLY MOVE C3 TO CONNECT RFB TO IN_B.
C3
OUT_B
IN_B
GND
GND
GND
GND
GND
GND
V
Considerations
CC
28
29
30
31
32
33
34
35
36
27
1
26
2
ATTEN_B
25
3
V
CC
24
4
MAX19790
R1
23
5
The EP MuST be soldered to a ground plane on the
PCB, either directly or through an array of plated via
holes. Soldering the pad to ground is also critical
for efficient heat transfer. Use a solid ground plane
wherever possible.
ATTEN_A
C2
22
ATTENUATION-
6
CIRCUITRY
CONTROL
21
7
C1
RFA
20
8
EP
Typical Application Circuit
19
9
18
17
16
15
14
13
12
11
10
GND
GND
GND
GND
GND
V
GND
CTRL
GND
CC
CTRL
V
CC
R3
R4
C7
C6
C9
C8