MAX19790ETX+T Maxim Integrated Products, MAX19790ETX+T Datasheet - Page 2

• Manufacturer Part Number: MAX19790ETX+T
• Description: Active Attenuator 250MHz to 4000MHz Du al, Analog Voltage V
• Manufacturer: Maxim Integrated Products

Specifications of MAX19790ETX+T

• Mounting Style: SMD/SMT
• Package / Case: QFN-36
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

250MHz to 4000MHz Dual,
Analog Voltage Variable Attenuator
ABSOLuTE MAxIMuM RATINGS
V
CTRL to GND (with V
All Other Pins to GND .............................. -0.3V to (V
RF Input ......................................................................... +20dBm
Current into CTRL Pin (V
Maximum Junction Temperature .....................................+150°C
Operating Temperature Range .......................... -40°C to +85°C
Note 1: T
Note 2: Based on junction temperature T
Note 3: Junction temperature T
Note 4: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
DC ELECTRICAL CHARACTERISTICS
(V
-40°C to +85°C, unless otherwise noted. Typical values are at V
RECOMMENDED AC OPERATING CONDITIONS
2
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
SuPPLY
Supply Voltage
Supply Current
CONTROL INPuT
Control Voltage Range
Control Input Resistance
RF Frequency Range
CC
CC
to GND ..........................................................-0.3V to +5.5V
CAUTION! ESD SENSITIVE DEVICE
= +4.75V to +5.25V, V
pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction
temperature must not exceed +150°C.
known. The junction temperature must not exceed +150°C.
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
C
PARAMETER
PARAMETER
is the temperature on the exposed pad of the package. T
CC
CC
= +5.0V applied) ............ 0V to +4.75V
grounded) .............................40mA
CTRL
J
= T
= +1.0V to +4.0V, no RF signals applied, all input and output ports terminated with 50I, T
SYMBOL
SYMBOL
A
R
V
+ (θ
V
CTRL
I
CTRL
f
CC
RF
CC
J
= T
JA
C
x V
+ (θ
(Note 5)
(Note 6)
CC
CC
JC
x I
x V
+ 0.3V)
CC
CC
). This formula can be used when the ambient temperature of the PCB is
x I
CONDITIONS
CONDITIONS
CC
CC
). This formula can be used when the temperature of the exposed
= +5.0V, V
Storage Temperature Range ........................….-65°C to +150°C
Continuous Power Dissipation (T
θ
θ
Lead Temperature (soldering, 10s) ................................+300°C
Soldering Temperature (reflow) ......................................+260°C
JC
JA
A
is the ambient temperature of the device and PCB.
(Notes 2, 4) ............................................................ +10°C/W
(Notes 3, 4) ............................................................ +35°C/W
CTRL
= +1.0V, T
C
4.75
MIN
MIN
250
= +25°C, unless otherwise noted.)
1.0
50
C
= +85°C) (Note 1) .......2.1W
TYP
TYP
5.0
7.3
MAx
MAx
4000
5.25
9.5
4.0
uNITS
uNITS
MHz
mA
kI
V
V
C
=