T494D106M050AH Kemet, T494D106M050AH Datasheet - Page 57

• Manufacturer Part Number: T494D106M050AH
• Manufacturer: Kemet

Specifications of T494D106M050AH

• Tolerance (+ Or -): 20%
• Voltage: 50VDC
• Esr: 700mOhm
• Mounting Style: Surface Mount
• Construction: SMT Chip
• Case Style: Molded
• Case Code: D
• Df: 6%
• Dcl: 5uA
• Specification: Coml-Low ESR-Ind
• Operating Temp Range: -55C to 125C
• Capacitance: 10uF
• Package / Case: 7343
• Lead Free Status / RoHS Status: Not Compliant

Tantalum Surface Mount Capacitors – Low ESR
Tantalum Stack MnO
Soldering Process
KEMET’s families of surface mount tantalum capacitors are
compatible with wave (single or dual), convection, IR or vapor
phase refl ow techniques. Preheating of these components
is recommended to avoid extreme thermal stress. KEMET's
recommended profi le conditions for convection and IR refl ow refl ect
the profi le conditions of the IPC/J-STD-020D standard for moisture
sensitivity testing. The devices can safely withstand a maximum
of three refl ow passes at these conditions. Note that although the
X/7343-43 case size can withstand wave soldering, the tall profi le
(4.3mm maximum) dictates care in wave process development.
Note 1: All temperatures refer to the center of the package, measured on the
package body surface that is facing up during assembly refl ow.
* Case Size D, E, P, Y and X
**Case Size A, B, C, H, I, K, M, R, S, T, U, V, W and Z
Construction
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 [phone] • www.kemet.com
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 [phone] • www.kemet.com
Time 25°C to peak temperature
Time within 5°C of max peak
Liquidous Temperature (T
Time (t
Ramp-down rate (T
Time above liquidous (t
Temperature Max (T
Profi le Feature
Temperature Min (T
Ramp-up rate (T
Peak Temperature (T
temperature (t
Preheat/Soak
s
Ref
) from T
A
B
C
smin
L
to T
to T
P
P
)
to T
Smin
Smax
smax
2
P
P
L
)
Surface Mount Capacitors – TSM Series MnO
)
)
)
)
L
L
Leadframe Attach
)
)
Lead Termination
)
Leadframe
Name
Sn-Pb Assembly
6 minutes max
3°C/sec max
6°C/sec max
20 sec max
60-120 sec
60-150 sec
235°C**
220°C*
100°C
150°C
183°C
Solder Coated Alloy 752
High Temp Solder
BeCu Alloy 190
Material
Pb-Free Assembly
8 minutes max
3°C/sec max
6°C/sec max
30 sec max
60-120 sec
60-150 sec
260°C**
250°C*
150°C
200°C
217°C
2
T
T
25
smax
smin
T
T
P
L
Max Ramp Up Rate = 3 ° C/sec
Max Ramp Down Rate = 6 ° C/sec
Time/Temperature Soldering Profi le
25° C to Peak
t
S
Time
TC101-1 • 5/11/2011
T2021-1 • 5/11/2011
t
L
t
P
57
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