GNM314R71H102KD01 Murata, GNM314R71H102KD01 Datasheet - Page 149
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GNM314R71H102KD01
Manufacturer Part Number
GNM314R71H102KD01
Description
Manufacturer
Murata
Type
Ceramicr
Datasheet
1.GNM314R71H102KD01.pdf
(220 pages)
Specifications of GNM314R71H102KD01
Capacitance
1000pF
No. Of Capacitors
4
Tolerance (+ Or -)
10%
Voltage
50VDC
Number Of Terminals
8Terminal
Temp Coeff (dielectric)
X7R
Operating Temp Range
-55C to 125C
Mounting Style
Surface Mount
Package / Case
1206
Construction
SMT Chip
Failure Rate
Not Required
Product Height (mm)
0.8mm
Product Depth (mm)
1.6mm
Product Length (mm)
3.2mm
Lead Diameter (nom)
Not Requiredmm
Terminal Pitch
0.8mm
Lead Free Status / RoHS Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
GNM314R71H102KD01D
Manufacturer:
MURATA
Quantity:
120 000
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!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
4-2. Flow Soldering
1. When sudden heat is applied to the components, the
2. Excessively long soldering time or high soldering
3. When components are immersed in solvent after
4. Do not apply flow soldering to chips not listed in table 2.
Table 2
Recommended Conditions
5. Optimum Solder Amount for Flow Soldering
Preheating Peak Temperature
!Caution
Soldering Peak Temperature
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage in the components, preheating
should be required for both of the components and the
PCB board.
Preheating conditions are shown in table 2. It is required
to keep temperature differential between the solder and
the components surface ( T) as small as possible.
temperature can result in leaching of the outer electrodes,
causing poor adhesion or a reduction in capacitance
value due to loss of contact between electrodes and end
termination.
mounting, be sure to maintain the temperature difference
( T) between the component and solvent within the range
shown in the table 2.
5-1. The top of the solder fillet should be lower than the
Continued from the preceding page.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
thickness of components. If the solder amount is
excessive, the risk of cracking is higher during board
bending or any other stressful condition.
GRM18/21/31
LLL21/31
ERB18/21
GQM18/21
Atmosphere
Part Number
Pb-Sn Solder
240 to 250 C
90 to 110 C
Air
Temperature Differential
TV150 C
Lead Free Solder
100 to 120 C
250 to 260 C
N
2
[Standard Conditions for Flow Soldering]
[Allowable Flow Soldering Temperature and Time]
Temperature (D)
Preheating
Peak
Temperature
Soldering
Peak
Temperature
In case of repeated soldering, the accumulated
soldering time must be within the range shown above.
280
270
260
250
240
230
220
0
Adhesive
30-90 seconds
10
Preheating
T
20
Continued on the following page.
Soldering
5 seconds max.
Soldering Time (sec.)
30
Up to Chip Thickness
!Caution
Gradual
Cooling
Time
in section
40
147
C02E.pdf
09.9.18
8
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