GNM314R71H102KD01 Murata, GNM314R71H102KD01 Datasheet - Page 166
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GNM314R71H102KD01
Manufacturer Part Number
GNM314R71H102KD01
Description
Manufacturer
Murata
Type
Ceramicr
Datasheet
1.GNM314R71H102KD01.pdf
(220 pages)
Specifications of GNM314R71H102KD01
Capacitance
1000pF
No. Of Capacitors
4
Tolerance (+ Or -)
10%
Voltage
50VDC
Number Of Terminals
8Terminal
Temp Coeff (dielectric)
X7R
Operating Temp Range
-55C to 125C
Mounting Style
Surface Mount
Package / Case
1206
Construction
SMT Chip
Failure Rate
Not Required
Product Height (mm)
0.8mm
Product Depth (mm)
1.6mm
Product Length (mm)
3.2mm
Lead Diameter (nom)
Not Requiredmm
Terminal Pitch
0.8mm
Lead Free Status / RoHS Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
GNM314R71H102KD01D
Manufacturer:
MURATA
Quantity:
120 000
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8
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
(4) Results
7. Solder Heat Resistance
(1) Test Method
(2) Test samples
(3) Acceptance criteria
(4) Results
164
Reference Data
q Reflow soldering:
w Flow soldering:
GRM21: For flow/reflow soldering T=0.6mm
The starting time of leaching should be defined as the
time when the outer electrode has lost 25% of the total
edge length of A-B-C-D as illustrated:
Continued from the preceding page.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Apply about 300 m of solder paste over the alumina
substrate. After reflow soldering, remove the chip and
check for leaching that may have occurred on the
outer electrode.
After dipping the test sample with a pair of tweezers in
wave solder (eutectic solder), check for leaching that
may have occurred on the outer electrode.
280
270
260
250
240
230
220
210
280
270
260
250
240
230
220
210
0
0
Reflow Soldering
Dip Soldering
10
60
Leaching Starting Time (sec.)
Leaching Starting Time (sec.)
20
120
30
180
40
240
50
60
e Dip soldering:
r Flux to be used: An ethanol solution of 25% rosin.
After dipping the test sample with a pair of tweezers in
static solder (eutectic solder), check for leaching that
may have occurred on the outer electrode.
280
270
260
250
240
230
220
210
100
0
Flow Soldering
80
60
40
20
0
200
10
Leaching Starting Time (sec.)
Temperature Differential T (D)
20
240
30
B
C
280
40
Continued on the following page.
D
50
A
Outer Electrode
320
60
360
F5
R7
5C
C02E.pdf
09.9.18
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