BCW33,215 NXP Semiconductors, BCW33,215 Datasheet - Page 2

• Manufacturer Part Number: BCW33,215
• Description: TRANSISTOR NPN 32V 100MA SOT23
• Manufacturer: NXP Semiconductors

Specifications of BCW33,215

• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Transistor Type: NPN
• Current - Collector (ic) (max): 100mA
• Voltage - Collector Emitter Breakdown (max): 32V
• Vce Saturation (max) @ Ib, Ic: 210mV @ 2.5mA, 50mA
• Dc Current Gain (hfe) (min) @ Ic, Vce: 420 @ 2mA, 5V
• Power - Max: 250mW
• Frequency - Transition: 100MHz
• Mounting Type: Surface Mount
• Dc Collector/base Gain Hfe Min: 420
• Minimum Operating Temperature: - 65 C
• Configuration: Single
• Transistor Polarity: NPN
• Mounting Style: SMD/SMT
• Collector- Emitter Voltage Vceo Max: 32 V
• Emitter- Base Voltage Vebo: 5 V
• Continuous Collector Current: 100 mA
• Maximum Dc Collector Current: 200 mA
• Power Dissipation: 250 mW
• Maximum Operating Frequency: 100 MHz
• Maximum Operating Temperature: + 150 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Collector Cutoff (max): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 933099650215; BCW33 T/R; BCW33 T/R

NXP Semiconductors
FEATURES
• Low current (100 mA)
• Low voltage (32 V).
APPLICATIONS
• General purpose switching and amplification.
DESCRIPTION
NPN transistors in a plastic SOT23 package.
PNP complements: BCW29 and BCW30.
MARKING
Note
1. * = p : Made in Hong Kong.
ORDERING INFORMATION
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
2004 Feb 06
BCW31
BCW32
BCW33
BCW31
BCW32
BCW33
V
V
V
I
I
I
P
T
T
T
C
CM
BM
NUMBER
SYMBOL
stg
j
amb
CBO
CEO
EBO
tot
NPN general purpose transistors
* = t : Made in Malaysia.
* = W : Made in China.
TYPE
TYPE NUMBER
collector-base voltage
collector-emitter voltage
emitter-base voltage
collector current (DC)
peak collector current
peak base current
total power dissipation
storage temperature
junction temperature
operating ambient temperature
NAME
PARAMETER
−
MARKING CODE
plastic surface mounted package; 3 leads
D1*
D2*
D3*
open emitter
open base; I
open collector
T
(1)
amb
≤ 25 °C
DESCRIPTION
2
CONDITIONS
PACKAGE
PINNING
handbook, halfpage
C
= 2 mA
PIN
1
2
3
Fig.1 Simplified outline (SOT23) and symbol.
Top view
base
emitter
collector
1
3
−
−
−
−
−
−
−
−65
−
−65
MIN.
DESCRIPTION
BCW31; BCW32;
2
MAM255
32
32
5
100
200
200
250
+150
150
+150
Product data sheet
MAX.
1
VERSION
SOT23
BCW33
3
2
V
V
V
mA
mA
mA
mW
°C
°C
°C
UNIT