BCX52,115 NXP Semiconductors, BCX52,115 Datasheet - Page 4

TRANSISTOR PNP 60V 1A SOT89

BCX52,115

Manufacturer Part Number
BCX52,115
Description
TRANSISTOR PNP 60V 1A SOT89
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BCX52,115

Package / Case
SC-62, SOT-89, TO-243 (3 Leads + Tab)
Transistor Type
PNP
Current - Collector (ic) (max)
1A
Voltage - Collector Emitter Breakdown (max)
60V
Vce Saturation (max) @ Ib, Ic
500mV @ 50mA, 500mA
Dc Current Gain (hfe) (min) @ Ic, Vce
63 @ 150mA, 2V
Power - Max
1.3W
Frequency - Transition
145MHz
Mounting Type
Surface Mount
Dc Collector/base Gain Hfe Min
63 at 5 mA at 2 V
Minimum Operating Temperature
- 65 C
Configuration
Single Dual Collector
Transistor Polarity
PNP
Mounting Style
SMD/SMT
Collector- Emitter Voltage Vceo Max
60 V
Emitter- Base Voltage Vebo
5 V
Maximum Dc Collector Current
1 A
Power Dissipation
1300 mW
Maximum Operating Frequency
145 MHz
Maximum Operating Temperature
+ 150 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Collector Cutoff (max)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
933272290115
BCX52 T/R
BCX52 T/R

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BCX52,115
Manufacturer:
NEXPERIA/安世
Quantity:
20 000
NXP Semiconductors
6. Thermal characteristics
BCP52_BCX52_8
Product data sheet
Fig 1. Power derating curves SOT223
(1) FR4 PCB, mounting pad for collector 1 cm
(2) FR4 PCB, standard footprint
P
(W)
tot
1.6
1.2
0.8
0.4
0
75
25
(1)
(2)
0
Table 7.
[1]
[2]
[3]
Symbol
R
R
25
th(j-a)
th(j-sp)
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm
75
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
thermal resistance from
junction to solder point
125
BCP52
BCX52
BCP52
BCX52
T
006aaa220
amb
2
( C)
Rev. 08 — 25 February 2008
175
Fig 2. Power derating curves SOT89
P
(W)
Conditions
in free air
(1) FR4 PCB, mounting pad for collector 6 cm
(2) FR4 PCB, mounting pad for collector 1 cm
(3) FR4 PCB, standard footprint
tot
1.6
1.2
0.8
0.4
0
75
60 V, 1 A PNP medium power transistors
25
(1)
(2)
(3)
0
[1]
[2]
[1]
[2]
[3]
25
BCP52; BCX52
Min
-
-
-
-
-
-
-
75
Typ
-
-
-
-
-
-
-
© NXP B.V. 2008. All rights reserved.
125
T
006aaa221
amb
Max
190
125
230
135
95
17
20
2
2
( C)
175
2
2
Unit
K/W
K/W
K/W
K/W
K/W
K/W
K/W
.
.
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