BOXDP55SB Intel (CPU), BOXDP55SB Datasheet - Page 22

• Manufacturer Part Number: BOXDP55SB
• Manufacturer: Intel (CPU)

Specifications of BOXDP55SB

• Lead Free Status / RoHS Status: Supplier Unconfirmed

1.10 Audio Subsystem
1.10.1
1.10.2
22
The board supports the Intel High Definition Audio subsystem based on the Realtek
ALC889 audio codec. The audio subsystem supports the following features:
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•
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Audio software and drivers are available from Intel’s World Wide Web site.
The board contains audio connectors and headers on both the back panel and the
component side of the board. The component-side audio headers include the
following:
•
•
For information about
Obtaining audio software and drivers
For information about
The locations of the front panel audio header and S/PDIF audio header
The signal names of the front panel audio header and S/PDIF header
The back panel audio connectors
Advanced jack sense for the back panel audio jacks that enables the audio codec to
recognize the device that is connected to an audio port. The back panel audio
jacks are capable of retasking according to the user’s definition, or can be
automatically switched depending on the recognized device type.
Stereo input and output for all back panel jacks
Line out and Mic in functions for front panel audio jacks
A signal-to-noise (S/N) ratio of 90 dB
Front panel audio (a 2 x 5-pin header that provides mic in and line out signals for
front panel audio connectors) (yellow)
S/PDIF audio header (1 x 4-pin header) (yellow)
Audio Subsystem Software
Audio Connectors and Headers
Refer to
Section 1.3, page 14
Refer to
Figure 11, page 43
Table 10, page 45
Section 2.2.1, page 42