1469081-1 TE Connectivity, 1469081-1 Datasheet - Page 2

• Manufacturer Part Number: 1469081-1
• Description: Conn Advanced TCA SKT 60 POS 2.5mm Press Fit RA Thru-Hole
• Manufacturer: TE Connectivity
• Type: Advanced TCAr
• Series: Z-PACK HM-Zd Seriesr

Specifications of 1469081-1

• Pitch: 2.5 mm
• Number Of Rows: 6
• Number Of Contacts: 60
• Termination Method: Press Fit
• Mounting: Through Hole
• Contact Plating: Gold Over Nickel
• Pitch (mm): 2.5mm
• Gender: SKT
• Body Orientation: Right Angle
• Number Of Contact Rows: 6
• Mounting Style: Through Hole
• Voltage Rating Max: 250VAC
• Current Rating (max): 7/ContactA
• Operating Temp Range: -65C to 105C
• Housing Material: Polyester
• Product Depth (mm): 23.4mm
• Product Length (mm): 24.9mm
• Rohs Compliant: YES
• Product Type: Receptacles
• Termination Style: Solder
• Contact Material: Copper Nickel Silicon
• Connector Type: Connector Assembly
• Pcb Mounting Orientation: Right Angle
• Shield Material: Phosphor bronze
• Module Length (mm [in]): 24.90 [0.980]
• Interface Type: HM-Zd
• Termination End Plating: Tin-Lead over Nickel
• Card Slot Pitch (mm [in]): 20.3 [0.8]
• Columns Per Connector: 10
• Centerline (mm [in]): 2.50 [0.098]
• Selectively Loaded: No
• Number Of Positions: 60
• Contact Type: Socket
• Contact Termination Type: Through Hole
• Contact Configuration: ACTION PIN Post
• Contact Base Material: Copper-Nickel-Silicon
• Number Of Pairs Per Column: 3
• Number Of Pairs Per Connector: 30
• Advancedtca Specified Product: No
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Not relevant for lead free process
• Rohs/elv Compliance History: Always was RoHS compliant
• Lead Free Status / RoHS Status: Compliant
• Lead Free Status / RoHS Status: Compliant

6
Product Facts
Catalog 1773095
Issued 4-05
www.tycoelectronics.com
Z-PACK HM-Zd Connector is
an extension of the Z-PACK
2mm HM product line
Designed specifically for
high speed differential
applications
A modular connector system
with a standard module size
of 25.00 [.984]
Contact pitch is 1.50 [.059]
within a pair and 3.00
[.118] pair to pair within a
column; column to column
pitch is 2.50 [.098]
Card Pitch is less than
20.32 [.800] for 2 pair and
3 pair headers and 25.40
[1.000] for 4 pair headers
Available in three versions:
Available in vertical and
right angle press fit pin
headers and right angle and
vertical press fit receptacles
Optimized footprint for
improved electrical
performance and ease of
trace routing (unobstructed
routing channels on both
daughtercard and
backplane)
Pin header and receptacle
have the exact same
footprint to simplify PC
board layout
Designed to meet Telcordia
requirements
Recognized under the
Component Program
of Underwriters
Laboratories Inc.,
File No. E28476
2 signal contact pairs
per column (20 pairs per
25.00 [.984]) compatible
with 5 row Z-PACK
2mm HM Connector
3 signal contact pairs
per column (30 pairs per
25.00 [.984])
4 signal contact pairs
per column (40 pairs per
25.00 [.984]) compatible
with 8 row Z-PACK
2mm HM Connector
Dimensions are in millimeters
and inches unless otherwise
specified. Values in brackets
are U.S. equivalents.
R
High Speed Backplane Connectors
Z-PACK HM-Zd Product Line Overview
The Z-PACK HM-Zd
Connector System is a high
speed, differential connec-
tor system, which is com-
patible with the Z-PACK
2mm HM Connector Line.
Z-PACK HM-Zd Connector
provides Z-PACK 2mm HM
Connector users with a
migration path for serial
Availability
Technical Documents
Product Specification
108-2055
Application Specification
114-13059
Qualification Test Report
501-568
Fully validated SPICE models: E-mail requests to [e-mail]
Samples: go to http://tycoelectronics.custhelp.com
Pro/E models and IGES models: E-mail requests to [e-mail]
White Papers: available on product website at http://hmzd.tycoelectronics.com
Electrical Performance Report: http://hmzd.tycoelectronics.com
Routing Guide: http://hmzd.tycoelectronics.com
http://hmzd.tycoelectronics.com
Dimensions are shown for
reference purposes only.
to change.
Routing Guide #20GC015-1
Specifications subject
switching applications from
3.125 Gb/s to 10+ Gb/s.
The Z-PACK HM-Zd
Connector System features
a highly reliable dual beam
contact system with fully
encompassing grounds
dedicated to each differen-
tial pair. In addition, the
Z-PACK HM-Zd Connector
EPR #20GC014
Material and Finish
Contact Area Finish — 0.80µm Au
min. over 1.3µm Ni min.
Compliant Pin Finish — 0.8µm
SnPb min. over 1.3µm Ni min.
Contact Material — Copper Alloy
Housing Material — Glass filled
polyester, 94V-0 rated
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-5-729-0425
footprint is optimized for
both routability and system
performance with the use of
a 1.50 x 2.50 [.059 x .098]
row to column grid. The
connector design features a
robust mating interface with
integral prealignment and
polarization built into the
mating interface.
Ratings
Current — 0.7A per signal contact,
fully energized 2A per shield, all shields
energized
Operating Voltage —
500 VAC maximum, signal to signal
250 VAC maximum, signal to ground
Temperature — –65°C to 105°C
Mating Force — 0.38N maximum per
contact (signal = 1 contact, ground =
1 contact)
Durability — 250 cycles
* Reference Product Spec. 108-2055 for
complete list of performance data.
South America: 55-11-3611-1514
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-141-810-8967