1469081-1 TE Connectivity, 1469081-1 Datasheet - Page 35

• Manufacturer Part Number: 1469081-1
• Description: Conn Advanced TCA SKT 60 POS 2.5mm Press Fit RA Thru-Hole
• Manufacturer: TE Connectivity
• Type: Advanced TCAr
• Series: Z-PACK HM-Zd Seriesr

Specifications of 1469081-1

• Pitch: 2.5 mm
• Number Of Rows: 6
• Number Of Contacts: 60
• Termination Method: Press Fit
• Mounting: Through Hole
• Contact Plating: Gold Over Nickel
• Pitch (mm): 2.5mm
• Gender: SKT
• Body Orientation: Right Angle
• Number Of Contact Rows: 6
• Mounting Style: Through Hole
• Voltage Rating Max: 250VAC
• Current Rating (max): 7/ContactA
• Operating Temp Range: -65C to 105C
• Housing Material: Polyester
• Product Depth (mm): 23.4mm
• Product Length (mm): 24.9mm
• Rohs Compliant: YES
• Product Type: Receptacles
• Termination Style: Solder
• Contact Material: Copper Nickel Silicon
• Connector Type: Connector Assembly
• Pcb Mounting Orientation: Right Angle
• Shield Material: Phosphor bronze
• Module Length (mm [in]): 24.90 [0.980]
• Interface Type: HM-Zd
• Termination End Plating: Tin-Lead over Nickel
• Card Slot Pitch (mm [in]): 20.3 [0.8]
• Columns Per Connector: 10
• Centerline (mm [in]): 2.50 [0.098]
• Selectively Loaded: No
• Number Of Positions: 60
• Contact Type: Socket
• Contact Termination Type: Through Hole
• Contact Configuration: ACTION PIN Post
• Contact Base Material: Copper-Nickel-Silicon
• Number Of Pairs Per Column: 3
• Number Of Pairs Per Connector: 30
• Advancedtca Specified Product: No
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Not relevant for lead free process
• Rohs/elv Compliance History: Always was RoHS compliant
• Lead Free Status / RoHS Status: Compliant
• Lead Free Status / RoHS Status: Compliant

Z-PACK HM-Zd Connector
Footprint and PC Board
Trace Routing
Benefits of Quad Routing
For further details request Report # 20GC015-1 or visit
http://catalog.tycoelectronics.com/TE/GeneralInfo/footprint_optimization.pdf
Catalog 1773095
Issued 4-05
www.tycoelectronics.com
Accounts for system design
requirements
Footprint is optimized for
low noise and ease of
routing
Footprint permits wide
traces for long runs and
without having to separate
differential pairs
Footprint supports quad
routing techniques
(see below)
Better Platform
Characteristics
Enables a lower cost
solution
Performance variation
due to layer connection
is reduced
Crosstalk is reduced
Return loss is reduced
Cost of better materials
is offset by reduced
processing
Increased manufactura-
bility—less layers and
decreased aspect ratios
Decreased number of
layers reduces the need
for counterboring of
PC boards
Dimensions are in millimeters
and inches unless otherwise
specified. Values in brackets
are U.S. equivalents.
High Speed Backplane Connectors
Z-PACK HM-Zd Connector
QuadRoute
Standard
4 Layers
2 Layers
[.048]
1.22
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
[.187]
4.75
[.207]
5.25
[.115]
[.059]
2.92
1.50
(Continued)
[.187]
4.75
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-5-729-0425
13.25
[.522]
[.187]
4.75
[.207]
5.25
Notes Regarding Quad
Routing:
1. Within pin field, center
2. Trace separation is
3. Recommend Quad
Notes Regarding Antipad
Design:
1. An oval shaped antipad
2. Antipad length shown is
signal pairs between
signal columns
increased over “standard”
recommendations to
further limit trace to trace
crosstalk
Routing pairs together
that are propagating in
the same direction
may be used to increase
PC board manufactura-
bility and to improve
trace break-out
2.92 [.114]. An antipad
length up to 3.48 [.137]
may be used.
South America: 55-11-3611-1514
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-141-810-8967
[.187]
4.75
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