145246-1 TE Connectivity, 145246-1 Datasheet - Page 64
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145246-1
Manufacturer Part Number
145246-1
Description
Conn Card Edge SKT 184 POS 1.27mm Solder ST SMD
Manufacturer
TE Connectivity
Type
Card Edger
Specifications of 145246-1
Number Of Contacts
184
Contact Plating
Gold Over Nickel
Mounting
Surface Mount
Termination Method
Solder
Pitch
1.27 mm
Number Of Rows
2
Number Of Contact Rows
2
Body Orientation
Straight
Contact Material
Phosphor Bronze
Mounting Style
Surface Mount
Product Height (mm)
15.49mm
Operating Temp Range
-55C to 85C
Pitch (mm)
1.27mm
Housing Material
Thermoplastic
Housing Color
Natural
Current Rating (max)
1/ContactA
Voltage Rating Max
203VAC
Contact Resistance Max
30
Peak Reflow Compatible (260 C)
No
Body Material
Polyphenylene Sulfide
Leaded Process Compatible
No
Rohs Compliant
No
Pcb Mounting Orientation
Vertical
Number Of Dual Positions
92
Pcb Mount Style
Surface Mount
Holddown Material
Brass
Holddown Plating
Tin-Lead over Nickel
Voltage (vac)
3.3
Solder Tail Contact Plating
Tin-Lead over Nickel
Number Of Positions
184
Centerline (mm [in])
1.27 [0.050]
Bus Width
64 Bit
Pcb Mount Retention Type
Hold Down Post(s)
Ejector
Without
Number Of Holddowns
3
Family Name
PCI
Contact Plating, Mating Area, Material
Gold (30)
Contact Base Material
Phosphor Bronze
Rohs/elv Compliance
Not ELV/RoHS compliant
Lead Free Solder Processes
Reflow solder capable to 245°C
Lead Free Status / RoHS Status
Not Compliant
64
64
Catalog 1654080
Issued 7-03
www.tycoelectronics.com
Product Facts
*Consult Tyco Electronics engi-
neering when paralleling con-
tacts for power applications.
Wide variety of sizes avail-
able from 3 dual positions
and up—no initial tooling
investment required for new
versions
Connectors can be selec-
tively loaded with contacts
in custom patterns
Connectors tooled on all
standard centerlines—
.100 [2.54], .125 [3.18],
.150 [3.81], .156 [3.96],
and .200 [5.08]
Note: .200 [5.08] centerline capabili-
ties provided by loading every-other
dual position of .100 [2.54] centerline
housings.
Closed card entry protects
contacts and daughter
board pads
Adapts to a wide range of
mother board thicknesses
to .104 [2.64] maximum
Phosphor bronze contacts
selectively plated for top
performance and maximum
economy
Protective channel helps
prevent overstress of
contacts
Daughter board keying
available in intercontact or
on-contact styles
Recognized under the
Component Program
of Underwriters
Laboratories Inc.,
File No. E28476
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
Card Edge Connectors
(Solder Type, Board-to-Board)
The AMP Twin Leaf
Connector is a highly
reliable, low-cost mother/
daughter board connector
designed for solid-state
circuitry. The one-piece,
multi-contact connector
requires no front-end tooling.
This versatile connector for
double-sided printed circuit
boards uses preloaded
contacts and selective plat-
ing to give lowest applied
cost. Critical contact areas
are gold-over-nickel plated
to provide positive electrical
connection between con-
tacts and daughter board
pads. Contact posts are tin
plated for efficient dip
soldering to mother boards
up to .104 [2.64] thick.
The Twin Leaf Connector
delivers high reliability
because the contacts
possess superior tolerance
of environmental stresses
including shock, vibration
and variations of tempera-
ture and humidity. Other
characteristics such as high
insulation resistance, low
Twin Leaf Mother Board Connectors
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
termination resistance, long
life and moderate contact
separation force meet
industry requirements for
reliability. Connectors are
tooled in sizes from 3
through 80 dual-contact
positions with contacts on
.100 [2.54], .125 [3.18],
.150 [3.81], .156 [3.96]
or .200 [5.08] centers.
Other sizes and custom-
loaded contact patterns
are available on request.
The connector housing,
made of glass-filled poly-
ester with a UL 94V-0
rating, features a standoff
which facilitates the use of a
probe for electrical continuity
checks without risk of dam-
age to the contacts. A
closed card-entry design of
the housing protects the
contacts and daughter
board pads. Housings
accept daughter boards
ranging from .055 [1.40] to
.070 [1.78] in thickness.
Intercontact and on-contact
keys are available for
polarization of the housings.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-5-729-0425
Card guides or end caps
make alignment of daughter
board pads with Twin Leaf
Connector contacts quick
and easy.
Performance Specifications
Contact Rating*:
3 amperes continuous
Temperature Rating:
–55°C to +105°C
Insulation Resistance:
5,000 megohms
Dielectric Withstanding Voltage:
Sea Level
50,000 ft
15 240 m
70,000 ft
21 336 m
Termination Resistance:
10 milliohms, max.
Durability: Tested to 100 cycles
(engage/withdraw)
Contact Plating: .000015 [0.00038]
selective gold plating on contact area;
bright tin on solder tine
Altitude
South America: 55-11-3611-1514
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-141-810-8967
.100 [2.54]
Test Voltage (AC, RMS)
1,000
400
280
Contact Spacing
.150 [3.81]
1,500
600
400