145246-1 TE Connectivity, 145246-1 Datasheet - Page 94
![Conn Card Edge SKT 184 POS 1.27mm Solder ST SMD](/photos/41/38/413830/pr145246_sml.jpg)
145246-1
Manufacturer Part Number
145246-1
Description
Conn Card Edge SKT 184 POS 1.27mm Solder ST SMD
Manufacturer
TE Connectivity
Type
Card Edger
Specifications of 145246-1
Number Of Contacts
184
Contact Plating
Gold Over Nickel
Mounting
Surface Mount
Termination Method
Solder
Pitch
1.27 mm
Number Of Rows
2
Number Of Contact Rows
2
Body Orientation
Straight
Contact Material
Phosphor Bronze
Mounting Style
Surface Mount
Product Height (mm)
15.49mm
Operating Temp Range
-55C to 85C
Pitch (mm)
1.27mm
Housing Material
Thermoplastic
Housing Color
Natural
Current Rating (max)
1/ContactA
Voltage Rating Max
203VAC
Contact Resistance Max
30
Peak Reflow Compatible (260 C)
No
Body Material
Polyphenylene Sulfide
Leaded Process Compatible
No
Rohs Compliant
No
Pcb Mounting Orientation
Vertical
Number Of Dual Positions
92
Pcb Mount Style
Surface Mount
Holddown Material
Brass
Holddown Plating
Tin-Lead over Nickel
Voltage (vac)
3.3
Solder Tail Contact Plating
Tin-Lead over Nickel
Number Of Positions
184
Centerline (mm [in])
1.27 [0.050]
Bus Width
64 Bit
Pcb Mount Retention Type
Hold Down Post(s)
Ejector
Without
Number Of Holddowns
3
Family Name
PCI
Contact Plating, Mating Area, Material
Gold (30)
Contact Base Material
Phosphor Bronze
Rohs/elv Compliance
Not ELV/RoHS compliant
Lead Free Solder Processes
Reflow solder capable to 245°C
Lead Free Status / RoHS Status
Not Compliant
94
AMP ACTION PIN
Press-Fit Contacts
PC Board Thickness
ACTION PIN contacts are
designed for use in a variety of
PC board thicknesses. However,
certain ACTION PIN contacts
are to be used in specific ranges
of board thicknesses. To
promote optimum performance,
the recommended board thick-
nesses provided with the con-
nector being used must be
followed.
ACTION PIN Contact/PC Board Applications
*Maximum hardness of copper layer is 150 Knoop.
Note: Recommended annular ring diameter is hole diameter plus .020 [0.51].
Catalog 1654080
Issued 7-03
www.tycoelectronics.com
Connector
Linear ZIF
Type
Material Thickness
ACTION PIN
Contact
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
.025
0.64
Card Edge Connectors
(Solder Type, Board-to-Board)
Linear ZIF Connectors
Drilled Hole
Diameter
.0453
1.151
±.001
±0.03
ACTION PIN contacts provide a reliable press-fit connection.
Localized pressure in the interface area entails oxide
break-through and helps prevent corrosion in the harshest
environments to provide a reliable connection virtually every
time. Also, radial and axial distortion are controlled to meet
today’s standards for multilayer board applications.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
Copper *
.001-.003
0.03-0.08
Plating Thicknesses
(Continued)
Tin-Lead
.0003
0.008
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-5-729-0425
Min.
Through-Hole
Diameter
.037-.043
0.94-1.09
Plated
South America: 55-11-3611-1514
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-141-810-8967
Specified
Average
Radial Hole Distortion
Not
Annular Ring (See Note)
Drilled Hole
Copper Thickness
Tin-Lead Thickness
Plated Through-Hole
Maximum
Specified
Not