BTA216B-600B,118 NXP Semiconductors, BTA216B-600B,118 Datasheet
BTA216B-600B,118
Specifications of BTA216B-600B,118
934048180118
BTA216B-600B /T3
Related parts for BTA216B-600B,118
BTA216B-600B,118 Summary of contents
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... ˚C prior to j surge 16 0 / over any period - Product specification BTA216B series B MAX. MAX. MAX. UNIT 500B 600B 800B 500 600 800 140 140 140 SYMBOL T2 MAX. UNIT -500 -600 -800 1 1 500 600 800 16 140 150 ...
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... 125 ˚ 125 ˚C D DRM(max) j CONDITIONS 125 ˚C; DM DRM(max) j exponential waveform; gate open circuit V = 400 125 ˚ T(RMS) without snubber; gate open circuit 0 DRM(max / Product specification BTA216B series B MIN. TYP. MAX. UNIT - - 1.2 K 1.7 K K/W MIN. TYP. MAX. UNIT ...
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... I p 20ms. VGT(25 C) 1.6 I TSM 1.4 T time 1.2 1 0.8 0.6 0.4 100 1000 - Product specification BTA216B series B BT139 100 Tmb / C BT139 0.1 1 surge duration / s , versus surge duration, for sinusoidal T(RMS) currents Hz; T 99˚C. mb VGT(Tj) BT136 0 50 100 Fig.6. Normalised gate trigger voltage )/ V (25˚ ...
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... Fig.11. Transient thermal impedance dIcom/dt (A/ms) 1000 100 100 150 ( (25˚C), Fig.12. Typical, critical rate of change of commutating current Product specification BTA216B series B BT139 typ max 0.5 1 1 BT139 unidirectional bidirectional 0.1ms 1ms 10ms 0.1s 1s 10s versus th j-mb pulse width t ...
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... October 1997 10.3 max 11 max 15.4 0.85 max (x2) Fig.13. SOT404 : centre pin connected to mounting base. 11.5 9.0 2.0 3.8 5.08 Fig.14. SOT404 : minimum pad sizes for surface mounting . 5 Product specification BTA216B series B 4.5 max 1.4 max 2.5 0.5 17.5 Rev 1.100 ...
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... Philips customers using or selling these products for use in such applications their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. October 1997 BTA216B series B 6 Product specification Rev 1.100 ...