4-103185-0 TE Connectivity, 4-103185-0 Datasheet - Page 14
![Conn Unshrouded Header HDR 40 POS 2.54mm Solder ST Thru-Hole](/photos/30/72/307205/pr1055044a_l_sml.jpg)
4-103185-0
Manufacturer Part Number
4-103185-0
Description
Conn Unshrouded Header HDR 40 POS 2.54mm Solder ST Thru-Hole
Manufacturer
TE Connectivity
Type
Unshrouded Headerr
Series
AMPMODU MOD II Seriesr
Specifications of 4-103185-0
Pitch
2.54 mm
Number Of Rows
1
Number Of Contacts
40
Gender
HDR
Contact Plating
Gold Over Nickel
Termination Method
Solder
Pitch (mm)
2.54mm
Number Of Contact Rows
1
Mounting Style
Through Hole
Body Orientation
Straight
Operating Temp Range
-65C to 105C
Current Rating (max)
3/ContactA
Contact Material
Phosphor Bronze
Housing Material
Thermoplastic
Housing Color
Black
Product Height (mm)
8.13mm
Product Length (mm)
101.19mm
Product Depth (mm)
2.34mm
Peak Reflow Compatible (260 C)
No
Leaded Process Compatible
No
Connector Type
Board-to-Board
Rohs Compliant
No
Product Type
Headers - Breakaway
Number Of Positions / Contacts
40
Row Spacing
2.54 mm
Mounting Angle
Vertical
Termination Style
Solder
Current Rating
3 A
Operating Temperature Range
- 65 C to + 105 C
Mount Angle
Vertical
Pcb Mount Retention
Without
Surface Mount Compatible
No
Board Standoff
Without
Mounting Ears
Without
Mating Connector Lock
Without
Post Size (mm [in])
0.64 [.025]
Mating Post Length (mm [in])
5.84 [0.230]
Panel Mount Retention
Without
Current Rating (a)
3
Insulation Resistance (m?)
5,000
Dielectric Withstanding Voltage (v)
750
Termination Post Length (mm [in])
3.05 [0.120]
Solder Tail Contact Plating
Tin-Lead over Nickel
Header Type
Breakaway
Number Of Positions
40
Centerline (mm [in])
2.54 [0.100]
Row-to-row Spacing (mm [in])
2.54 [0.100]
Selectively Loaded
No
Mount Type
Printed Circuit Board
Contact Plating, Mating Area, Material
Gold (15)
Contact Shape
Square
Contact Base Material
Phosphor Bronze
Ul Flammability Rating
UL 94V-0
Rohs/elv Compliance
ELV compliant, 5 of 6 Compliant
Lead Free Solder Processes
Wave solder capable to 240°C
Approved Standards
UL E28476, CSA LR7189
Operating Temperature (°c)
-65 – +105
High Temperature Housing
No
High Speed Serial Data Connector
No
Lead Free Status / RoHS Status
Not Compliant
Lead Free Status / RoHS Status
Not Compliant
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Product Facts
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Catalog 1307819
Revised 8-08
www.tycoelectronics.com
Surface-mount products for
parallel board-to-board
applications, as well as
right-angle board-to-board
and cable-to-board
applications
High density .050 x .050
[1.27x1.27] centerline grid
Three board-to-board stack
heights: .250 [6.35], .320
[8.13] and .390 [9.91]
Non-protrusive metallic
holddowns
Reliable dual beam
receptacle contacts for
redundant contact
Duplex plated receptacle
and post contacts; gold
plated on mating areas,
tin plated on tails
Compatible with standard
surface-mount processing
(VPR and IR)
Receptacle and header allow
for drainage of processing
fluids
Tape and reel packaging
available. Contact
Tyco Electronics for details
Polarized header and recep-
tacle assemblies
Sizes of 10, 20, 30, 40, 50,
60, 70, 80 and 100 positions
Recognized under the
Component Program of
Underwriters
Laboratories Inc.,
File No. E28476
Certified by
Canadian Standards
Association
File No. LR7189
R
are metric equivalents.
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
R
AMPMODU Interconnection System
Board-to-Board Vertical Receptacles and Headers
AMPMODU 50/50 Grid
Vertical Headers and
Receptacles are designed
for parallel board-to-board
stacking in high density
applications.
Right-angle board-to-board
and cable-to-board
applications are also
possible, since the vertical
receptacles also mate with
non-latching right-angle
headers (page 19) and the
vertical headers also mate
with non-latching cable
connectors.
Available are double row,
vertical shrouded headers
and receptacles in sizes
ranging from 10 through
100 positions (in 10 position
increments).
Parallel board-to-board
stack heights of .250 [6.35],
.320 [8.13] and .390 [9.91]
are achievable by selection
of the appropriate header.
The receptacle is the same
for all three stack height
headers.
Non-protrusive metallic
holddowns are designed for
use in .062 [1.57] or thicker
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
PC boards and allow
surface mounting to both
sides of the board. In
addition to providing
retention during processing,
the holddowns are soldered
during reflow and therefore
provide long-term strain relief
for the solder joints.
AMPMODU 50/50 Grid
Vertical Headers and
Receptacles are designed
to be compatible with
standard surface-mount
processes; IR (infrared) and
VPR (vapor phase reflow).
The surface-mount
connectors have been
designed so that
dimensioning, tolerances,
referenced datums,
holddown characteristics
Non-Protrusive
Metallic Holddowns
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
and packaging methods
result in a system that is
compatible with robotic
assembly.
The headers and
receptacles feature
polarization to prevent
misalignment.
Three Board Stack Heights
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208
[9.91±0.15]
[6.35±0.15 ]
[8.13±0.15]
.390±.006
.250±.006
.320±.006
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