4-103185-0 TE Connectivity, 4-103185-0 Datasheet - Page 183
![Conn Unshrouded Header HDR 40 POS 2.54mm Solder ST Thru-Hole](/photos/30/72/307205/pr1055044a_l_sml.jpg)
4-103185-0
Manufacturer Part Number
4-103185-0
Description
Conn Unshrouded Header HDR 40 POS 2.54mm Solder ST Thru-Hole
Manufacturer
TE Connectivity
Type
Unshrouded Headerr
Series
AMPMODU MOD II Seriesr
Specifications of 4-103185-0
Pitch
2.54 mm
Number Of Rows
1
Number Of Contacts
40
Gender
HDR
Contact Plating
Gold Over Nickel
Termination Method
Solder
Pitch (mm)
2.54mm
Number Of Contact Rows
1
Mounting Style
Through Hole
Body Orientation
Straight
Operating Temp Range
-65C to 105C
Current Rating (max)
3/ContactA
Contact Material
Phosphor Bronze
Housing Material
Thermoplastic
Housing Color
Black
Product Height (mm)
8.13mm
Product Length (mm)
101.19mm
Product Depth (mm)
2.34mm
Peak Reflow Compatible (260 C)
No
Leaded Process Compatible
No
Connector Type
Board-to-Board
Rohs Compliant
No
Product Type
Headers - Breakaway
Number Of Positions / Contacts
40
Row Spacing
2.54 mm
Mounting Angle
Vertical
Termination Style
Solder
Current Rating
3 A
Operating Temperature Range
- 65 C to + 105 C
Mount Angle
Vertical
Pcb Mount Retention
Without
Surface Mount Compatible
No
Board Standoff
Without
Mounting Ears
Without
Mating Connector Lock
Without
Post Size (mm [in])
0.64 [.025]
Mating Post Length (mm [in])
5.84 [0.230]
Panel Mount Retention
Without
Current Rating (a)
3
Insulation Resistance (m?)
5,000
Dielectric Withstanding Voltage (v)
750
Termination Post Length (mm [in])
3.05 [0.120]
Solder Tail Contact Plating
Tin-Lead over Nickel
Header Type
Breakaway
Number Of Positions
40
Centerline (mm [in])
2.54 [0.100]
Row-to-row Spacing (mm [in])
2.54 [0.100]
Selectively Loaded
No
Mount Type
Printed Circuit Board
Contact Plating, Mating Area, Material
Gold (15)
Contact Shape
Square
Contact Base Material
Phosphor Bronze
Ul Flammability Rating
UL 94V-0
Rohs/elv Compliance
ELV compliant, 5 of 6 Compliant
Lead Free Solder Processes
Wave solder capable to 240°C
Approved Standards
UL E28476, CSA LR7189
Operating Temperature (°c)
-65 – +105
High Temperature Housing
No
High Speed Serial Data Connector
No
Lead Free Status / RoHS Status
Not Compliant
Lead Free Status / RoHS Status
Not Compliant
- Current page: 183 of 320
- Download datasheet (17Mb)
Closed Dual Entry, Side and
End Stackable Low Profile,
.100 x .100 [2.54 x 2.54]
Centerline, .150 [3.81] Tine
Spacing
Material and Finish
Housing — Glass-filled thermoplastic,
black, 94V-0 rated
Contacts — Phosphor bronze,
plated as follows:
Plating A — Duplex .000030 [0.00076]
gold on contact area, .000150-.000300
[0.00381-0.00762] matte tin on solder
area all over .000050 [0.00127] nickel
Plating B — Duplex .000010
[0.000254] gold on contact area,
.000150-.000300 [0.00381-0.00762]
matte tin on solder area all over .000050
[0.00127] nickel
Plating C — .000150-.000300
[0.00381-0.00762] matte tin on solder
leads, all over .000050 [0.00127] nickel
Related Product Data
Mateable Headers —
Refer to the Mating Post Selection
Guide — page 90
Performance Characteristics —
page 174
Technical Documents
Product Specification
108-25022
Application Specification
114-25018
Note: All part numbers are RoHS
Catalog 1307819
Revised 8-08
www.tycoelectronics.com
compliant.
— page 276
are metric equivalents.
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
[
.075
.060
1.90
AMPMODU Interconnection System
Mod. IV Receptacle Assemblies, Double-Row,
.100 x .100 [2.54 x 2.54] Centerline
[5.03]
Notes: 1. Tyco Electronics recommends mating gold or duplex plated headers with duplex plated receptacle assemblies.
.198
No. of
+.005
+0.13
- 0.00
Pos.
[2.54]
-.000
.100
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
2
4
6
8
]
for Bottom Entry or Pass Through Applications
2. To obtain the minimum mating post length, add .020 [0.51] (not including the post lead in chamfer) to
Typ.
Dia.
the maximum point-of-contact dimension, and .062 [1.57] for recommended board thickness if used in bot-
tom entry application.
*±.003 [±0.08] tolerances not to accumulate
Recommended PC Board Hole Layout
[1.27]
1.000 [25.40]
1.100 [27.94]
1.200 [30.48]
1.300 [33.02]
1.400 [35.56]
1.500 [38.10]
1.600 [40.64]
1.700 [43.18]
1.800 [45.72]
1.900 [48.26]
2.000 [50.80]
Max.
.050
Typ.
within one connector pattern.
.100 [2.54]
.200 [5.08]
.300 [7.62]
.400 [10.16]
.500 [12.70]
.600 [15.24]
.700 [17.78]
.800 [20.32]
.900 [22.86]
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
A
Dimensions
[2.54]
.100*
B
A
Typ.
1.000 [25.40]
1.100 [27.94]
1.200 [30.48]
1.300 [33.02]
1.400 [35.56]
1.500 [38.10]
1.600 [40.64]
1.700 [43.18]
1.800 [45.72]
1.900 [48.26]
.100 [2.54]
.200 [5.08]
.300 [7.62]
.400 [10.16]
.500 [12.70]
.600 [15.24]
.700 [17.78]
.800 [20.32]
.900 [22.86]
—
B
[6.22]
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
.245
Typ.
(Standoffs)
[2.54±0.08]
.100±.003
[0.51]
.020
Typ.
[2.54]
.100
Typ.
5-535542-1
5-535542-2
5-535542-3
5-535542-4
5-535542-5
5-535542-6
5-535542-7
5-535542-8
5-535542-9
6-535542-0
6-535542-1
6-535542-2
6-535542-3
6-535542-4
6-535542-5
6-535542-6
6-535542-7
6-535542-8
6-535542-9
7-535542-0
Plating A
[0.89±0.08]
.035±.003
(Localized Gold
Recommended PC Board Hole Layout
Plate Area)
Contact Plating/Part Nos.
[3.77]
[2.72]
.107
Dia. Typ.
.148
Typ.
Typ.
[2.54]
.100
Typ.
5-147095-1
5-147095-2
5-147095-3
5-147095-4
5-147095-5
5-147095-6
5-147095-7
5-147095-8
5-147095-9
6-147095-0
6-147095-1
6-147095-2
6-147095-3
6-147095-4
6-147095-5
6-147095-6
6-147095-7
6-147095-8
6-147095-9
7-147095-0
Plating B
for Top Entry
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208
Point of
Contact
B
5-147096-1
5-147096-2
5-147096-3
5-147096-4
5-147096-5
5-147096-6
5-147096-7
5-147096-8
5-147096-9
6-147096-0
6-147096-1
6-147096-2
6-147096-3
6-147096-4
6-147096-5
6-147096-6
6-147096-7
6-147096-8
6-147096-9
7-147096-0
Plating C
[3.30±0.25]
.130±.010
[3.81]
.150
Typ.
Typ.
[3.81]
.150
Typ.
183
5
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