274-1AB Wakefield Thermal Solutions, 274-1AB Datasheet - Page 2
![HEATSINK TO-220 LOW HEIGHT BLK](/photos/5/88/58821/274-1ab_sml.jpg)
274-1AB
Manufacturer Part Number
274-1AB
Description
HEATSINK TO-220 LOW HEIGHT BLK
Manufacturer
Wakefield Thermal Solutions
Series
274r
Specifications of 274-1AB
Thermal Resistance
8 C / W
Height
0.375" (9.53mm)
Color
Black
Package Cooled
TO-220
Attachment Method
Bolt On and PC Pin
Outline
19.05mm x 13.21mm
Power Dissipation @ Temperature Rise
2W @ 56°C
Thermal Resistance @ Forced Air Flow
8.0°C/W @ 400 LFM
Thermal Resistance @ Natural
28°C/W
Product
Heatsinks
Mounting Style
SMD/SMT
Heatsink Material
Aluminum
Fin Style
Folded
Dimensions
13.21 mm L x 9.53 mm W x 19.05 mm H
Designed For
TO-220
Packages Cooled
TO-220
Width
19.1mm
Heat Sink Material
Aluminum
Length
13.2mm
Mounting Type
Screw
Package / Case
TO-220
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
345-1023
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
274-1AB
Manufacturer:
WAK
Quantity:
13 432
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
217 SERIES
MECHANICAL DIMENSIONS
PATENT PENDING
MECHANICAL DIMENSIONS
Dimensions: in.
Dimensions: in. (mm)
Normally stocked
217 SERIES
234 SERIES
TUBE: 16.25 Inches Long,
20 Pieces per Tube
Min. ESDMaterial with Nail
Stops
TUBE DETAILS
234-75AB
217-36CTT6
Surface Mount Heat Sinks
230 AND 234 SERIES
Standard
P/N
230-75AB
230-75AB-01
230-75AB-05
230-75AB-10
234-75AB
234-75AB-01
234-75AB-05
Material: Aluminum, Black Anodized
230-75AB-01
Height Above
.750 (19.1)
.500 (12.7)
.750 (19.1)
.500 (12.7)
.875 (22.2)
.790 (20.0)
.790 (20.0)
PC Board
in. (mm)
234-75AB-01
REF: JEDEC TO-263 (DD PAK)
REF: JEDEC MO-169 (DD PAK)
Compact, Wavesolderable Low-Profile Self-Locking Heat Sinks
230-75AB-10
BOARD LAYOUT RECOMMENDATIONS
.570 (14.5) x .500 (12.7)
.570 (14.5) x .500 (12.7)
.750 (19.1) x .570 (14.5)
.570 (14.5) x .500 (12.7)
.570 (14.5) x .500 (12.7)
.570 (14.5) x .500 (12.7)
.790 (20.0) x .570 (14.5)
Dimensions
in. (mm)
Footprint
230 AND 234 SERIES
234-75AB-05
31
Configuation
Vert./Horiz.
Vert./Horiz
Horizontal
Mounting
Horizontal
Vertical
Vertical
Vertical
SOL 20
Solderable
All other products, please contact factory for price, delivery, and minimums.
230-75AB-05
No Tab
No Tab
Option
234 SERIES
Tab
01
05
10
01
05
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Mounting
Style
CONVECTION CHARACTERISTICS
Thermal Performance at Typical Load
NATURAL AND FORCED
Convection
57°C @ 2W
57°C @ 2W
57°C @ 2W
57°C @ 2W
57°C @ 2W
57°C @ 2W
57°C @ 2W
Natural
230 SERIES
217-36CT6
D
2
PAK, TO-220, SOL-20
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
Board Level
Heat Sinks
Convection)
Forced
TO-220