274-1AB Wakefield Thermal Solutions, 274-1AB Datasheet - Page 20
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274-1AB
Manufacturer Part Number
274-1AB
Description
HEATSINK TO-220 LOW HEIGHT BLK
Manufacturer
Wakefield Thermal Solutions
Series
274r
Specifications of 274-1AB
Thermal Resistance
8 C / W
Height
0.375" (9.53mm)
Color
Black
Package Cooled
TO-220
Attachment Method
Bolt On and PC Pin
Outline
19.05mm x 13.21mm
Power Dissipation @ Temperature Rise
2W @ 56°C
Thermal Resistance @ Forced Air Flow
8.0°C/W @ 400 LFM
Thermal Resistance @ Natural
28°C/W
Product
Heatsinks
Mounting Style
SMD/SMT
Heatsink Material
Aluminum
Fin Style
Folded
Dimensions
13.21 mm L x 9.53 mm W x 19.05 mm H
Designed For
TO-220
Packages Cooled
TO-220
Width
19.1mm
Heat Sink Material
Aluminum
Length
13.2mm
Mounting Type
Screw
Package / Case
TO-220
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
345-1023
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
274-1AB
Manufacturer:
WAK
Quantity:
13 432
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
Use these low-height heat sinks on printed circuit board applications for TO-66 power semi-
conductors and DO-4 and DO-5 diodes, where close board-to-board spacing and efficient
Use this low-cost TO-3 heat sink style for multiple TO-3 applications on a single printed cir-
cuit board, where two or more TO-3s must be placed in proximity and minimum space is
Normally stocked
MECHANICAL DIMENSIONS
Dimensions: in. (mm)
Dimensions: in. (mm)
MECHANICAL DIMENSIONS
(EXTRUSION PROFILE 1284)
635 SERIES
601 SERIES
601 AND 603 SERIES
Standard
P/N
601E
601F
601K
603K
Material: Aluminum Alloy, Black Anodized
635 SERIES
Standard
P/N
635-5B2
635-75B2
635-10B2
635-125B2
Material: Aluminum Alloy, Black Anodized
2.000 (50.8) x 1.250 (31.8)
2.000 (50.8) x 1.250 (31.8)
2.000 (50.8) x 1.250 (31.8)
2.000 (50.8) x 2.000 (50.8)
Space-Saving Low-Cost Heat Sinks
PC Board “A”
Height Above
0.500 (12.7)
0.750 (19.1)
1.250 (31.8)
1.000 (25.4)
in. (mm)
Dimensions
Footprint
in. (mm)
Low-Height Heat Sinks
K
1.900 (48.3) x 1.420 (36.0)
1.900 (48.3) x 1.420 (36.0)
1.900 (48.3) x 1.420 (36.0)
1.900 (48.3) x 1.420 (36.0)
Dimensions
in. (mm)
0.562 (14.3)
0.562 (14.3)
0.562 (14.3)
0.562 (14.3)
Outline
in. (mm)
SEMICONDUCTOR MOUNTING HOLES
Height
(EXTRUSION PROFILE 1284)
49
603 SERIES
heat dissipation are required. The 601 and 603 Series may also be attached to enclosure pan-
els or brackets using isolation hardware where necessary.
pattern in the base. Consult factory for TO-66, TO-220, and multilead IC hole patterns.
available for heat sinking. Four different heights are available, all with TO-3 mounting hole
E
0.200 (5.1)
0.270 (6.9)
Mounting
Hole Dia.
in. (mm)
None
None
90°C @ 8.0W
77°C @ 8.0W
61°C @ 8.0W
53°C @ 8.0W
Thermal Performance at Typical Load
Convection
Natural
All other products, please contact factory for price, delivery, and minimums.
52°C @ 5.0W
41°C @ 5.0W
52°C @ 5.0W
52°C @ 5.0W
Thermal Performance at Typical Load
Convection
CONVECTION CHARACTERISTICS
Natural
6.0°C/W @ 300 LFM
4.8°C/W @ 300 LFM
3.6°C/W @ 300 LFM
3.1°C/W @ 300 LFM
NATURAL AND FORCED
Convection
Forced
CONVECTION CHARACTERISTICS
F
NATURAL AND FORCED
4.5°C/W @ 175 LFM
4.5°C/W @ 175 LFM
4.5°C/W @ 175 LFM
4.0°C/W @ 175 LFM
Convection
Forced
Semiconductor
Hole Pattern
Mounting
TO-3
TO-3
TO-3
T0-3
DO-4/DO-5 Diodes
Board Level
Heat Sinks
0.0500 (22.68)
0.0500 (22.68)
0.0500 (22.68)
0.0810 (36.74)
0.0200 (9.07)
0.0220 (9.98)
0.024 (10.89)
0.028 (12.70)
lbs. (grams)
lbs. (grams)
Weight
Weight
TO-3