217-36CT6 Wakefield Thermal Solutions, 217-36CT6 Datasheet - Page 4

• Manufacturer Part Number: 217-36CT6
• Description: HEATSINK DPAK SMT TIN PLATED
• Manufacturer: Wakefield Thermal Solutions
• Series: 217r

Specifications of 217-36CT6

• Thermal Resistance: 16 C / W
• Height: 0.360" (9.14mm)
• Package Cooled: D²Pak
• Attachment Method: SMD Pad
• Outline: 18.80mm x 15.20mm
• Power Dissipation @ Temperature Rise: 1W @ 55°C
• Thermal Resistance @ Forced Air Flow: 16.0°C/W @ 200 LFM
• Thermal Resistance @ Natural: 55°C/W
• Product: Heatsinks
• Mounting Style: SMD/SMT
• Heatsink Material: Copper
• Fin Style: Folded
• Dimensions: 15.24 mm L x 18.8 mm W x 9.91 mm H
• Designed For: D2Pak, TO-220, SOT-223, SOL-20
• Packages Cooled: SOL-20 / SOT-223 / TO-220
• Width: 18.8mm
• Heat Sink Material: Copper
• Peak Reflow Compatible (260 C): No
• Length: 15.2mm
• Size: 0.390H X 0.600W X 0.740D"
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant, Contains lead / RoHS non-compliant
• Other names: 345-1012

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
Normally stocked
PATENT PENDING
PATENT 5381041
Dimensions: in. (mm)
MECHANICAL DIMENSIONS
MECHANICAL DIMENSIONS
239-75AB
235 SERIES
Standard
P/N
235-85AB
235-85AB-01
235-85AB-05
235-85AB-10
Material: Aluminum, Black Anodized
243 SERIES
Standard
P/N
243-1PAB
243-3PAB
Material: Aluminum, Pre-anodized Black
239 SERIES
Standard
P/N
239-75AB
239-75AB-03
239-75AB-04
Material: Aluminum, Black Anodized
235-85AB-05
243 SERIES
Height Above
Height Above
Height Above
1.000 (25.4)
Dimensions: in. (mm)
.850 (21.6)
.850 (21.6)
.500 (12.7)
.975 (24.8)
.750 (19.1)
.750 (19.1)
.750 (19.1)
.800 (20.3)
Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks
Labor-Saving Clip-On Heat Sinks
Snap-Down Self-Locking Heat Sinks
PC Board
PC Board
PC Board
in. (mm)
in. (mm)
in. (mm)
235-85AB
1.000 (25.4) x .500 (12.7)
1.000 (25.4) x .500 (12.7)
1.000 (25.4) x .500 (12.7)
1.120 (28.4) x .435 (11.0)
1.120 (28.4) x .435 (11.0)
1.120 (28.4) x .435 (11.0)
.850 (21.6) x1.000 (25.4)
MECHANICAL DIMENSIONS
.800 (20.3) x .270 (6.9)
.800 (20.3) x .270 (6.9)
SECTION A-A
Dimensions
Dimensions
Dimensions
Dimensions: in. (mm)
Footprint
Footprint
Footprint
in. (mm)
in. (mm)
in. (mm)
235-85AB-01
33
Configuration
Configuration
Configuration
SECTION A-A
Vert./Horiz.
Vert./Horiz.
Verl./Horiz.
239-75AB-03
Horizontal
Vert./Horiz
239-75AB-04
Mounting
Mounting
Mounting
239 SERIES
Vertical
Vertical
Vertical
Vertical
235-85AB-10
235 SERIES
Tab Options
Tab Options
Tab Options
Solderable
Solderable
Solderable
All other products, please contact factory for price, delivery, and minimums.
No Tab
No Tab
No Tab
No Tab
01
05
10
03
04
VIEW B-B
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Mounting
Mounting
Mounting
Style
Style
Style
Clip
Clip
40°C @ 2W
40°C @ 2W
Convection
40°C @ 2W
40°C @ 2W
Thermal Performance at Typical Load
Convection
Thermal Performance at Typical Load
Convection
38°C @ 2W
38°C @ 2W
38°C @ 2W
Thermal Performance at Typical Load
50°C@ 2W
78°C@ 2W
CONVECTION CHARACTERISTICS
CONVECTION CHARACTERISTICS
CONVECTION CHARACTERISTICS
Natural
Natural
Natural
NATURAL AND FORCED
NATURAL AND FORCED
NATURAL AND FORCED
6.8°C/W @ 400 LFM
6.8°C/W @ 400 LFM
6.8°C/W @ 400 LFM
6.8°C/W @ 400 LFM
4.5°C/W @ 400 LFM
8.2°C/W @ 400 LFM
6°C/W @ 400 LFM
6°C/W @ 400 LFM
6°C/W @ 400 LFM
Board Level
Convection
Convection
Convection
Heat Sinks
Forced
Forced
Forced
TO-220
TO-220
TO-220