658-25AB Wakefield Thermal Solutions, 658-25AB Datasheet - Page 10
![HEATSINK CPU 28MM SQ BLK](/photos/5/88/58881/658-25ab_t1_t2_t4_sml.jpg)
658-25AB
Manufacturer Part Number
658-25AB
Description
HEATSINK CPU 28MM SQ BLK
Manufacturer
Wakefield Thermal Solutions
Series
658r
Datasheet
1.658-60ABT3.pdf
(19 pages)
Specifications of 658-25AB
Height
0.250" (6.35mm)
Color
Black
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Not Included)
Outline
27.94mm x 27.94mm
Power Dissipation @ Temperature Rise
2W @ 40°C
Thermal Resistance @ Forced Air Flow
5°C/W @ 500 LFM
Product
Heatsinks
Mounting Style
SMD/SMT
Heatsink Material
Aluminum
Fin Style
Omnidirectional Pin
Dimensions
27.9 mm L x 27.9 mm W x 6.35 mm H
Designed For
BGA, Super BGA, PBGA, FPBGA, PowerPC
Packages Cooled
BGA / LED
Width
27.9mm
Heat Sink Material
Aluminum
Length
27.9mm
Mounting Type
Adhesive
Size
0.250H X 1.100W X 1.100L"
Package / Case
BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Thermal Resistance @ Natural
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
345-1036
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
658-25AB
Manufacturer:
WAK
Quantity:
11 210
Company:
Part Number:
658-25ABT3
Manufacturer:
WAK
Quantity:
10
HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
7
6
5
4
3
2
1
0
8
7
6
5
100
200
300
AIR VELOCITY (LFM)
400
500
600
700
14
12
10
8
6
4
2
0
100
7
6
5
4
3
2
1
0
8
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
7
6
5
100
100
100
7
6
5
4
3
2
1
0
200
200
200
200
300
AIR VELOCITY (LFM)
300
300
300
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
604-40AB
604-60AB
400
400
400
400
500
500
500
500
600
600
600
600
700
700
700
700
14
12
10
8
6
4
2
0
100
7
6
5
4
3
2
1
0
10
100
9
8
7
6
5
4
3
2
1
0
100
8
7
6
5
4
3
2
200