658-25AB Wakefield Thermal Solutions, 658-25AB Datasheet - Page 9
![HEATSINK CPU 28MM SQ BLK](/photos/5/88/58881/658-25ab_t1_t2_t4_sml.jpg)
658-25AB
Manufacturer Part Number
658-25AB
Description
HEATSINK CPU 28MM SQ BLK
Manufacturer
Wakefield Thermal Solutions
Series
658r
Datasheet
1.658-60ABT3.pdf
(19 pages)
Specifications of 658-25AB
Height
0.250" (6.35mm)
Color
Black
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Not Included)
Outline
27.94mm x 27.94mm
Power Dissipation @ Temperature Rise
2W @ 40°C
Thermal Resistance @ Forced Air Flow
5°C/W @ 500 LFM
Product
Heatsinks
Mounting Style
SMD/SMT
Heatsink Material
Aluminum
Fin Style
Omnidirectional Pin
Dimensions
27.9 mm L x 27.9 mm W x 6.35 mm H
Designed For
BGA, Super BGA, PBGA, FPBGA, PowerPC
Packages Cooled
BGA / LED
Width
27.9mm
Heat Sink Material
Aluminum
Length
27.9mm
Mounting Type
Adhesive
Size
0.250H X 1.100W X 1.100L"
Package / Case
BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Thermal Resistance @ Natural
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
345-1036
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
658-25AB
Manufacturer:
WAK
Quantity:
11 210
Company:
Part Number:
658-25ABT3
Manufacturer:
WAK
Quantity:
10
HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
Designed to fit a .063” thick PCB
electronic package thickness of .110”
See 609 Series for PCB hole layout for clip attachment
DIM.
“A”
619 95 AB 124 D1 S3
2.808
Thermal Interface Material Option
Blank
S5
S6
S3
S4
5
4
3
2
1
0
*Performance is for shrouded conditions. 609-100
will perform better than 609-50 in cases with bypass.
Bergquist Qpad 3
Bergquist Softface
Chomerics T710
Chomerics T443
*
609-100AB
100
None
609-50AB
AIR VELOCITY (LFM)
200
300
400
500