628-40AB Wakefield Thermal Solutions, 628-40AB Datasheet - Page 4

• Manufacturer Part Number: 628-40AB
• Description: HEATSINK CPU 43MM SQ BLK H=.4"
• Manufacturer: Wakefield Thermal Solutions
• Series: 628r

Specifications of 628-40AB

• Height: 0.4" (10.16mm)
• Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
• Attachment Method: Thermal Tape, Adhesive (Not Included)
• Outline: 44.45mm x 43.18mm
• Power Dissipation @ Temperature Rise: 2.5W @ 30°C
• Thermal Resistance @ Forced Air Flow: 4°C/W @ 300 LFM
• Product: Heatsinks
• Mounting Style: Screw
• Heatsink Material: Aluminum
• Fin Style: Omnidirectional Pin
• Dimensions: 44.45 mm L x 43.2 mm W x 10.2 mm H
• Designed For: BGA, Super BGA, PBGA, FPBGA
• Color: Black
• Packages Cooled: PGA / LED
• Thermal Resistance: 7°C/W
• Width: 43.2mm
• Heat Sink Material: Aluminum
• Length: 44.5mm
• Body Material: Aluminum
• Size: 0.400H X 1.750W X 1.700L"
• Mounting Type: Adhesive
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Thermal Resistance @ Natural: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 345-1061

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
Notes:
PRODUCT FEATURES
14
12
10
8
6
4
2
0
Performance shown is with T4 thermal adhesive applied.
200
300
Approach Velocity, LFM
400
642-25-T4
642-35-T4
642-45-T4
642-60-T4
500
600