628-40AB Wakefield Thermal Solutions, 628-40AB Datasheet - Page 7

HEATSINK CPU 43MM SQ BLK H=.4"

628-40AB

Manufacturer Part Number
628-40AB
Description
HEATSINK CPU 43MM SQ BLK H=.4"
Manufacturer
Wakefield Thermal Solutions
Series
628r
Datasheet

Specifications of 628-40AB

Height
0.4" (10.16mm)
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Not Included)
Outline
44.45mm x 43.18mm
Power Dissipation @ Temperature Rise
2.5W @ 30°C
Thermal Resistance @ Forced Air Flow
4°C/W @ 300 LFM
Product
Heatsinks
Mounting Style
Screw
Heatsink Material
Aluminum
Fin Style
Omnidirectional Pin
Dimensions
44.45 mm L x 43.2 mm W x 10.2 mm H
Designed For
BGA, Super BGA, PBGA, FPBGA
Color
Black
Packages Cooled
PGA / LED
Thermal Resistance
7°C/W
Width
43.2mm
Heat Sink Material
Aluminum
Length
44.5mm
Body Material
Aluminum
Size
0.400H X 1.750W X 1.700L"
Mounting Type
Adhesive
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Thermal Resistance @ Natural
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
345-1061
HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
2. Optional factory preapplied pressure-sensitive adhesive. See Page 3
PRODUCT FEATURES
919541 Series Heat Sink Thermal Performance
10
9
8
7
6
5
4
3
2
1
0
0
100
200
300
400
500
600
700
Approach Air Velocity, LFM
Performance shown is with S5 interface material applied.

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