628-65AB Wakefield Thermal Solutions, 628-65AB Datasheet - Page 18

• Manufacturer Part Number: 628-65AB
• Description: HEATSINK CPU 43MM SQ BLK H=.65"
• Manufacturer: Wakefield Thermal Solutions
• Series: 628r

Specifications of 628-65AB

• Height: 0.65" (16.5mm)
• Color: Black
• Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
• Attachment Method: Thermal Tape, Adhesive (Not Included)
• Outline: 44.45mm x 43.18mm
• Power Dissipation @ Temperature Rise: 4.5W @ 30°C
• Thermal Resistance @ Forced Air Flow: 1.5°C/W @ 400 LFM
• Product: Heatsinks
• Mounting Style: Screw
• Heatsink Material: Aluminum
• Fin Style: Omnidirectional Pin
• Dimensions: 44.45 mm L x 43.2 mm W x 16.5 mm H
• Designed For: BGA, Super BGA, PBGA, FPBGA
• Packages Cooled: PGA / LED
• Thermal Resistance: 3°C/W
• Width: 43.2mm
• Heat Sink Material: Aluminum
• Length: 44.5mm
• Mounting Type: Adhesive
• Size: 0.650H X 1.750W X 1.700L"
• Package / Case: PGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Thermal Resistance @ Natural: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 345-1062

ROCKER CLIP OPTION
(SEE PRODUCT DES.)
SPRING CLIP OPTION
(SEE PRODUCT DES.)
2.34
OPTIONAL THERMAL INTERFACE
PAD (SEE PRODUCT DES.)
1.00
2.68
.23
1.50
.42
1.50
100 = 1.00"
MODEL NUMBER
HEIGHT
569 - 100 XX - XX
THERMAL INTERFACE
S4 = DELTALINK IV
BLANK = NO THERMAL PAD
CLIP
AK = SPRING CLIP
14-16 Pin DIPs