628-65AB Wakefield Thermal Solutions, 628-65AB Datasheet - Page 6

HEATSINK CPU 43MM SQ BLK H=.65"

628-65AB

Manufacturer Part Number
628-65AB
Description
HEATSINK CPU 43MM SQ BLK H=.65"
Manufacturer
Wakefield Thermal Solutions
Series
628r
Datasheets

Specifications of 628-65AB

Height
0.65" (16.5mm)
Color
Black
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Not Included)
Outline
44.45mm x 43.18mm
Power Dissipation @ Temperature Rise
4.5W @ 30°C
Thermal Resistance @ Forced Air Flow
1.5°C/W @ 400 LFM
Product
Heatsinks
Mounting Style
Screw
Heatsink Material
Aluminum
Fin Style
Omnidirectional Pin
Dimensions
44.45 mm L x 43.2 mm W x 16.5 mm H
Designed For
BGA, Super BGA, PBGA, FPBGA
Packages Cooled
PGA / LED
Thermal Resistance
3°C/W
Width
43.2mm
Heat Sink Material
Aluminum
Length
44.5mm
Mounting Type
Adhesive
Size
0.650H X 1.750W X 1.700L"
Package / Case
PGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Thermal Resistance @ Natural
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
345-1062
HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
PRODUCT FEATURES
HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
Notes:
I I
L
G G
I

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