218-40CT3 Wakefield Thermal Solutions, 218-40CT3 Datasheet - Page 3

• Manufacturer Part Number: 218-40CT3
• Description: HEATSINK ALUM BLACK SMD
• Manufacturer: Wakefield Thermal Solutions
• Series: 218r

Specifications of 218-40CT3

• Thermal Resistance: 21 C / W
• Height: 0.4" (10.16mm)
• Package Cooled: SMD
• Attachment Method: SMD Pad
• Outline: 22.86mm x 8.12mm
• Power Dissipation @ Temperature Rise: 2W @ 52°C
• Thermal Resistance @ Forced Air Flow: 21°C/W @ 200 LFM
• Thermal Resistance @ Natural: 31°C/W
• Product: Heatsinks
• Mounting Style: SMD/SMT
• Heatsink Material: Aluminum
• Fin Style: Folded
• Dimensions: 22.86 mm L x 8 mm W x 10.16 mm H
• Designed For: SMT Devices
• Packages Cooled: TO-218 / TO-220
• Width: 22.9mm
• Heat Sink Material: Copper
• Mounting Type: PC Board Surface Mount
• Length: 8mm
• Body Plating: Matte Tin
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: 21840CT3; 345-1082

WTS001_p1-25
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
24
MECHANICAL DIMENSIONS
PATENT PENDING
Board Level
Heat Sinks
Dimensions: in. (mm)
234 SERIES
MECHANICAL DIMENSIONS
234-75AB
6/14/07
Standard
P/N
230-75AB
230-75ABE-01
230-75ABE-05
230-75ABE-10
234-75AB
234-75ABE-01
234-75ABE-05
Material: Aluminum, Black Anodized
Standard
P/N
206-1PABEH
Material: Aluminum, Black Anodized
230 & 234 SERIES
206 SERIES
10:54 AM
230-75AB-01
Height Above
.750 (19.1)
.750 (19.1)
.500 (12.7)
.875 (22.2)
.790 (20.0)
.790 (20.0)
.500 (12.7)
PC Board
in. (mm)
Page 24
234-75AB-01
Vertical Mount Heat Sink
230-75AB-10
Height Above
Compact, Wavesolderable Low-Profile Self-Locking Heat Sinks
1.18 (30.0)
PC Board
in. (mm)
.570 (14.5) x .500 (12.7)
.570 (14.5) x .500 (12.7)
.750 (19.1) x .570 (14.5)
.570 (14.5) x .500 (12.7)
.570 (14.5) x .500 (12.7)
.570 (14.5) x .500 (12.7)
.790 (20.0) x .570 (14.5)
Dimensions
Footprint
in. (mm)
230 AND 234 SERIES
234-75AB-05
1.00 (25.4) x .50 (12.7)
Configuation
Vert./Horiz.
Vert./Horiz
Horizontal
Horizontal
Mounting
Maximum
Vertical
Vertical
Vertical
Footprint
in. (mm)
100
80
60
40
20
Solderable
0
230-75AB-05
Option
No Tab
No Tab
234 SERIES
0
0
Tab
01
05
10
01
05
CONVECTION CHARACTERISTICS
200
200
2
Natural Convection
NATURAL AND FORCED
56°C rise @ 4W
HEAT DISSIPATED (WATTS)
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Mounting
AIR VELOCITY (LFM)
Style
400
400
4
Thermal Performance at Typical Load
CONVECTION CHARACTERISTICS
600
600
6
Thermal Performance at Typical Load
NATURAL AND FORCED
Convection
57°C @ 2W
57°C @ 2W
57°C @ 2W
57°C @ 2W
57°C @ 2W
57°C @ 2W
57°C @ 2W
Natural
800
800
8
230 SERIES
1000
1000
10
7.3°C/W @ 200LFM
Forced Convection
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
10
8
6
4
2
0
Convection)
Forced
TO-220
TO-220