218-40CT3 Wakefield Thermal Solutions, 218-40CT3 Datasheet - Page 6

• Manufacturer Part Number: 218-40CT3
• Description: HEATSINK ALUM BLACK SMD
• Manufacturer: Wakefield Thermal Solutions
• Series: 218r

Specifications of 218-40CT3

• Thermal Resistance: 21 C / W
• Height: 0.4" (10.16mm)
• Package Cooled: SMD
• Attachment Method: SMD Pad
• Outline: 22.86mm x 8.12mm
• Power Dissipation @ Temperature Rise: 2W @ 52°C
• Thermal Resistance @ Forced Air Flow: 21°C/W @ 200 LFM
• Thermal Resistance @ Natural: 31°C/W
• Product: Heatsinks
• Mounting Style: SMD/SMT
• Heatsink Material: Aluminum
• Fin Style: Folded
• Dimensions: 22.86 mm L x 8 mm W x 10.16 mm H
• Designed For: SMT Devices
• Packages Cooled: TO-218 / TO-220
• Width: 22.9mm
• Heat Sink Material: Copper
• Mounting Type: PC Board Surface Mount
• Length: 8mm
• Body Plating: Matte Tin
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: 21840CT3; 345-1082

WTS001_p26-49
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
PATENT PENDING
PATENT 5381041
MECHANICAL DIMENSIONS
Dimensions: in. (mm)
MECHANICAL DIMENSIONS
6/14/07
239-75AB
10:55 AM
Standard
P/N
235-85AB
235-85ABE-01
235-85ABE-05
235-85ABE-10
Material: Aluminum, Black Anodized
Standard
P/N
243-1PAB
243-3PAB
Material: Aluminum, Pre-anodized Black
Standard
P/N
239-75AB
239-75ABE-03
239-75ABE-04
Material: Aluminum, Black Anodized
235 SERIES
243 SERIES
239 SERIES
235-85AB-05
Page 27
243 SERIES
Height Above
Height Above
Height Above
Dimensions: in. (mm)
1.000 (25.4)
.850 (21.6)
.850 (21.6)
.500 (12.7)
.975 (24.8)
.750 (19.1)
.750 (19.1)
.750 (19.1)
.800 (20.3)
PC Board
PC Board
PC Board
in. (mm)
in. (mm)
in. (mm)
235-85AB
Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks
Snap-Down Self-Locking Heat Sinks
Labor-Saving Clip-On Heat Sinks
1.000 (25.4) x .500 (12.7)
1.000 (25.4) x .500 (12.7)
1.000 (25.4) x .500 (12.7)
1.120 (28.4) x .435 (11.0)
1.120 (28.4) x .435 (11.0)
1.120 (28.4) x .435 (11.0)
.850 (21.6) x 1.000 (25.4)
MECHANICAL DIMENSIONS
.800 (20.3) x .270 (6.9)
.800 (20.3) x .270 (6.9)
SECTION A-A
Dimensions
Dimensions
Dimensions
Dimensions: in. (mm)
Footprint
Footprint
Footprint
in. (mm)
in. (mm)
in. (mm)
235-85AB-01
Configuration
Configuration
Configuration
SECTION A-A
Vert./Horiz.
Vert./Horiz.
Verl./Horiz.
239-75AB-03
Vert./Horiz
239-75AB-04
Mounting
Horizontal
Mounting
Mounting
239 SERIES
Vertical
Vertical
Vertical
Vertical
235-85AB-10
235 SERIES
Tab Options
Tab Options
Tab Options
Solderable
Solderable
Solderable
No Tab
No Tab
No Tab
No Tab
01
05
10
03
04
VIEW B-B
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Mounting
Mounting
Mounting
Style
Style
Style
Clip
Clip
Convection
40°C @ 2W
40°C @ 2W
40°C @ 2W
40°C @ 2W
Convection
Convection
38°C @ 2W
38°C @ 2W
38°C @ 2W
Thermal Performance at Typical Load
Thermal Performance at Typical Load
50°C@ 2W
78°C@ 2W
Thermal Performance at Typical Load
CONVECTION CHARACTERISTICS
CONVECTION CHARACTERISTICS
CONVECTION CHARACTERISTICS
Natural
Natural
Natural
NATURAL AND FORCED
NATURAL AND FORCED
NATURAL AND FORCED
6.8°C/W @ 400 LFM
6.8°C/W @ 400 LFM
6.8°C/W @ 400 LFM
6.8°C/W @ 400 LFM
4.5°C/W @ 400 LFM
8.2°C/W @ 400 LFM
6°C/W @ 400 LFM
6°C/W @ 400 LFM
6°C/W @ 400 LFM
Board Level
Heat Sinks
Convection
Convection
Convection
Forced
Forced
Forced
TO-220
TO-220
TO-220
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