625-25ABT-4E Wakefield Thermal Solutions, 625-25ABT-4E Datasheet - Page 11

• Manufacturer Part Number: 625-25ABT-4E
• Description: BGA HEATSINK 25MM
• Manufacturer: Wakefield Thermal Solutions
• Series: 625r

Specifications of 625-25ABT-4E

• Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
• Attachment Method: Thermal Tape, Adhesive (Not Included)
• Outline: 25.00mm x 25.00mm
• Height: 0.250" (6.35mm)
• Product: Heatsinks
• Mounting Style: Screw
• Heatsink Material: Aluminum
• Fin Style: Omnidirectional Pin
• Dimensions: 25 mm L x 25 mm W x 6.4 mm H
• Designed For: BGA, Super BGA, PBGA, FPBGA
• Color: Black
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power Dissipation @ Temperature Rise: -
• Thermal Resistance @ Forced Air Flow: -
• Thermal Resistance @ Natural: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
7
6
5
4
3
2
1
0
8
7
6
5
4
3
2
1
0
7
6
5
4
3
2
100
100
200
200
300
300
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
400
400
500
500
600
600
700
700
7
6
5
4
3
2
1
0
8
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
100
100
100
14
12
10
8
6
4
2
0
100
7
6
5
4
3
2
1
0
6
5
4
3
2
1
0
100
7
6
5
4
3
2
1
0
10
100
9
8
7
6
5
200
200
200
200
200
200
300
300
300
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
300
300
AIR VELOCITY (LFM)
300
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
604-40AB
604-60AB
400
400
400
610-35AB
400
400
400
500
500
500
500
500
500
600
600
600
600
600
600
700
700
700
700
700
700
14
12
10
8
6
4
2
0