625-25ABT-4E Wakefield Thermal Solutions, 625-25ABT-4E Datasheet - Page 7

• Manufacturer Part Number: 625-25ABT-4E
• Description: BGA HEATSINK 25MM
• Manufacturer: Wakefield Thermal Solutions
• Series: 625r

Specifications of 625-25ABT-4E

• Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
• Attachment Method: Thermal Tape, Adhesive (Not Included)
• Outline: 25.00mm x 25.00mm
• Height: 0.250" (6.35mm)
• Product: Heatsinks
• Mounting Style: Screw
• Heatsink Material: Aluminum
• Fin Style: Omnidirectional Pin
• Dimensions: 25 mm L x 25 mm W x 6.4 mm H
• Designed For: BGA, Super BGA, PBGA, FPBGA
• Color: Black
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power Dissipation @ Temperature Rise: -
• Thermal Resistance @ Forced Air Flow: -
• Thermal Resistance @ Natural: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
2. Optional factory preapplied pressure-sensitive adhesive. See Page 3
PRODUCT FEATURES
919541 Series Heat Sink Thermal Performance
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9
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1
0
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Approach Air Velocity, LFM
Performance shown is with S5 interface material applied.