655-53AB Wakefield Thermal Solutions, 655-53AB Datasheet

655-53AB

Manufacturer Part Number

655-53AB

Description

HEATSINK CPU 40.6MM SQ H=.525"

Manufacturer

Wakefield Thermal Solutions

Series

655r

Datasheets

1.658-60ABT3.pdf (19 pages)

2.628-25AB.pdf (6 pages)

Specifications of 655-53AB

Height

0.52" (13.21mm)

Package Cooled

Assorted (BGA, LGA, CPU, ASIC...)

Attachment Method

Thermal Tape, Adhesive (Not Included)

Outline

40.64mm x 40.64mm

Power Dissipation @ Temperature Rise

4W @ 40°C

Thermal Resistance @ Forced Air Flow

2°C/W @ 400 LFM

Packages Cooled

BGA / LED

Width

40.6mm

Heat Sink Material

Aluminum

Length

40.6mm

Mounting Type

Adhesive

Color

Black

Size

0.525H X 1.600W X 1.600L"

Package / Case

BGA

Product

Heatsinks

Mounting Style

SMD/SMT

Heatsink Material

Aluminum

Fin Style

Omnidirectional Pin

Dimensions

40.6 mm L x 40.6 mm W x 13.3 mm H

Designed For

BGA, Super BGA, PBGA, FPBGA, PowerPC

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Thermal Resistance @ Natural

Lead Free Status / Rohs Status

Lead free / RoHS Compliant

Other names

345-1093
65553AB

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

655-53AB

Manufacturer:

WAK

Quantity:

2 457

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

655-53ABT3

Manufacturer:

WAK

Quantity:

500

Current page: 1 of 6
Download datasheet (499Kb)

All other products, please contact factory for price, delivery, and minimums.

Dimensions: in. (mm)

MECHANICAL DIMENSIONS

Dimensions: in. (mm)

P E N G U IN

Integrated Circuit

Heat Sinks

659 SERIES

Standard

P/N

659-65AB

Notes: 1. Optional factory preapplied pressure-sensitive adhesive. Pages 74–76.

655 SERIES

Standard

P/N

655-26AB

655-53AB

Notes: 1. Optional factory preapplied pressure-sensitive adhesive. Pages 74–76.

658 SERIES

Standard

P/N

658-25AB

658-35AB

658-45AB

658-60AB

Notes: 1. Optional factory preapplied pressure-sensitive adhesive. Pages 74–76.

™

COOLERS: HEAT SINKS FOR MICROPROCESSORS, ASICs AND BGAs

Unidirectional Fin Heat Sink for AMD Am386

Pin Fin Heat Sinks for PowerPC™ 601, PowerPC™ 603

Omnidirectional Pin Fin Heat Sinks for IntelDX4™,

AMD Am29240™, PowerPC™ 603

Base Dimensions

1.600 (40.6) sq

in. (mm)

Base Dimensions

1.100 (27.9) sq

Base Dimensions

1.45 (36.8) sq

in. (mm)

KEY:

658-25AB

Dimension “A”

0.525 (13.3)

0.260 (6.6)

in. (mm)

658-35AB

Dimension “A”

0.250 (6.4)

0.350 (8.9)

0.450 (8.9)

0.600 (8.9)

in. (mm)

0.650 (16.5)

in. (mm)

, PowerPC™ 601

Height

658-45AB

Dimension “B”

0.125 (3.2)

0.145 (3.7)

in. (mm)

658-60AB

CONVECTION CHARACTERISTICS

Black Anodized

Heat Sink

NATURAL AND FORCED

POWERQUAD2™, 28-38 mm CQFP/MQUAD™

NATURAL AND FORCED

Heat Sink

Finish

Black Anodized

Heat Sink

Finish

17 x 17 PGA, 32 mm CQFP

14 x 14, 38, 40 mm CQFP

40 mm CQFP

Normally stocked

0.050 (22.68)

0.038 (17.01)

0.050 (22.68)

0.031 (14.17)

lbs. (grams)

0.013 (5.67)

0.015 (6.70)

0.019 (8.50)

Weight

Related parts for 655-53AB

655-53AB Summary of contents

Page 1

... Dimensions: in. (mm) 655 SERIES Pin Fin Heat Sinks for PowerPC™ 601, PowerPC™ 603 Standard P/N 655-26AB 655-53AB Notes: 1. Optional factory preapplied pressure-sensitive adhesive. Pages 74–76. MECHANICAL DIMENSIONS 1 Dimensions: in. (mm) 658 SERIES Omnidirectional Pin Fin Heat Sinks for IntelDX4™, AMD Am29240™ ...

Page 2

PENGUIN ™ COOLERS: HEAT SINKS FOR MICROPROCESSORS, ASICs AND BGAs 624 SERIES Omnidirectional Pin Fin Heat Sink for 21mm BGAs Standard P/N 624-25AB 624-35AB 624-45AB 624-60AB Material: Aluminum, Black Anodized The 624 Series is an omnidirectional pin fin heat sink ...

Page 3

Integrated Circuit Heat Sinks ™ COOLERS: HEAT SINKS FOR MICROPROCESSORS, ASICs AND BGAs 660 SERIES Unidirectional Fin Heat Sink for PowerPC™ 603 Standard P/N 660-29AB Notes: 1. Optional factory preapplied pressure-sensitive adhesive. Pages 74–76. ...

Page 4

DELTEM ™ COMPOSITE HEAT SINKS FOR PQFPs, CQFPs, AND BGAs Deltem™ D10650-40 Pin Fin Heat Sink for 100-Lead PQFPs, 169 BGA Standard P/N D10650-40 Notes: Available with pressure sensitive adhesives for quick and easy mounting. Pages 74–76. Deltem™ D10850-40 Pin ...

Page 5

Integrated Circuit Heat Sinks ™ PENGUIN COOLERS: HEAT SINKS FOR MICROPROCESSORS AND ASICs 662 SERIES Pin Fin Heat Sink for Limited Height Applications for Intel 80486DX, AMD A Standard P/N 662-15AG Notes: 1. Optional factory preapplied pressure-sensitive adhesive. Pages 74–76. ...

Page 6

PENGUIN ™ COOLERS: HEAT SINKS FOR MICROPROCESSORS AND ASICs 609 SERIES Pin Fin Heat Sink/Clip Assembly for PowerPC™ 601, 604 (304 C4QFP, 255 CBGA Standard P/N 609-50AB 609-100AB Notes: 1. Optional factory preapplied thermal interface material. Pages 74–76. MECHANICAL DIMENSIONS ...

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