655-53AB Wakefield Thermal Solutions, 655-53AB Datasheet - Page 2

• Manufacturer Part Number: 655-53AB
• Description: HEATSINK CPU 40.6MM SQ H=.525"
• Manufacturer: Wakefield Thermal Solutions
• Series: 655r

Specifications of 655-53AB

• Height: 0.52" (13.21mm)
• Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
• Attachment Method: Thermal Tape, Adhesive (Not Included)
• Outline: 40.64mm x 40.64mm
• Power Dissipation @ Temperature Rise: 4W @ 40°C
• Thermal Resistance @ Forced Air Flow: 2°C/W @ 400 LFM
• Packages Cooled: BGA / LED
• Width: 40.6mm
• Heat Sink Material: Aluminum
• Length: 40.6mm
• Mounting Type: Adhesive
• Color: Black
• Size: 0.525H X 1.600W X 1.600L"
• Package / Case: BGA
• Product: Heatsinks
• Mounting Style: SMD/SMT
• Heatsink Material: Aluminum
• Fin Style: Omnidirectional Pin
• Dimensions: 40.6 mm L x 40.6 mm W x 13.3 mm H
• Designed For: BGA, Super BGA, PBGA, FPBGA, PowerPC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Thermal Resistance @ Natural: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 345-1093; 65553AB

PENGUIN
Normally stocked
MECHANICAL DIMENSIONS
MECHANICAL DIMENSIONS
™
COOLERS: HEAT SINKS FOR MICROPROCESSORS, ASICs AND BGAs
624 SERIES
Standard
P/N
624-25AB
624-35AB
624-45AB
624-60AB
Material: Aluminum, Black Anodized
The 624 Series is an omnidirectional pin fin heat sink for both natural and
forced-convection applications.
Applications include network routers and switches, high-resolution printers,
digital cameras, consumer video games, digital video disks (DVD) and
global positioning systems (GPS).
625 SERIES
Standard
P/N
625-25AB
625-35AB
625-45AB
625-60AB
Material: Aluminum, Black Anodized
The 625 Series is an omnidirectional pin fin heat sink for both natural and
forced-convection applications.
Applications include network routers and switches, high-resolution printers,
digital cameras, consumer video games, digital video disks (DVD) and
global positioning systems (GPS).
625 SERIES
Omnidirectional Pin Fin Heat Sink for 21mm BGAs
624 SERIES
Omnidirectional Pin Fin Heat Sink for 25mm BGAs
Base Dimensions
Base Dimensions
.984 (25)
.984 (25)
.984 (25)
.984 (25)
in. Sq.
.827 (21)
.827 (21)
.827 (21)
.827 (21)
in. Sq.
625 THERMAL PERFORMANCE
624 THERMAL PERFORMANCE
0.450 (11.4)
0.650 (15.2)
0.350 (8.9)
0.250 (6.4)
Fin Height
in. (mm)
“A”
Fin Height
.450 (11.4)
.600 (15.2)
.250 (6.4)
.350 (8.9)
in. (mm)
“A”
27
•
•
•
PRODUCT FEATURES
•
PRODUCT FEATURES
All other products, please contact factory for price, delivery, and minimums.
Available in four standard heights, .25 inch, .35 inch, .45 inch, and .60
inch.
Available with pressure sensitive adhesives for quick and easy mounting.
Pages 74–76.
Available in four standard heights, .25 inch, .35 inch, .45 inch, and .60
inch.
Available with pressure sensitive adhesives for quick and easy mounting.
Pages 74–76.
Applications
25 mm BGA
25 mm BGA
25 mm BGA
25 mm BGA
Applications
21mm BGA
21mm BGA
21mm BGA
21mm BGA
Typical
Typical
PRODUCT DESIGNATION
PRODUCT DESIGNATION
Integrated Circuit
Pages 74–76
Pages 74–76
Pages 74–76
Pages 74–76
Adhesive
Options
Dimensions: in.
Pages 74–76
Pages 74–76
Pages 74–76
Pages 74–76
Heat Sinks
Adhesive
Options
Dimensions: in.
lbs. (grams)
lbs. (grams)
.030 (13.62)
.026 (11.80)
.012 (5.45)
.014 (6.36)
.018 (8.17)
.009 (4.09)
.011 (4.99)
.015 (6.81)
Weight
Weight