655-53AB Wakefield Thermal Solutions, 655-53AB Datasheet - Page 8

• Manufacturer Part Number: 655-53AB
• Description: HEATSINK CPU 40.6MM SQ H=.525"
• Manufacturer: Wakefield Thermal Solutions
• Series: 655r

Specifications of 655-53AB

• Height: 0.52" (13.21mm)
• Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
• Attachment Method: Thermal Tape, Adhesive (Not Included)
• Outline: 40.64mm x 40.64mm
• Power Dissipation @ Temperature Rise: 4W @ 40°C
• Thermal Resistance @ Forced Air Flow: 2°C/W @ 400 LFM
• Packages Cooled: BGA / LED
• Width: 40.6mm
• Heat Sink Material: Aluminum
• Length: 40.6mm
• Mounting Type: Adhesive
• Color: Black
• Size: 0.525H X 1.600W X 1.600L"
• Package / Case: BGA
• Product: Heatsinks
• Mounting Style: SMD/SMT
• Heatsink Material: Aluminum
• Fin Style: Omnidirectional Pin
• Dimensions: 40.6 mm L x 40.6 mm W x 13.3 mm H
• Designed For: BGA, Super BGA, PBGA, FPBGA, PowerPC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Thermal Resistance @ Natural: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 345-1093; 65553AB

DELTEM
1 0 0
8 0
6 0
4 0
2 0
™
0
0
0
COMPOSITE HEAT SINKS FOR BGAs
200
0.25
HEAT DISSIPATED (WATTS)
AIR VELOCITY (LFM)
Available with pressure sensitive adhesives for quick and easy mounting. See Page 3
Available with pressure sensitive adhesives for quick and easy mounting. See Page 3
400
0.50
600
0.75
800
1.00
1000
1.25
3 0
2 5
2 0
1 5
1 0
5
0
1 0 0
8 0
6 0
4 0
2 0
0
0
0
200
0.25
HEAT DISSIPATED (WATTS)
AIR VELOCITY (LFM)
400
0.50
600
0.75
800
1.00
1000
1.25
1 6
1 4
1 2
1 0
8
6
4
2
0