LMC555CM/HFPB National Semiconductor, LMC555CM/HFPB Datasheet - Page 3

• Manufacturer Part Number: LMC555CM/HFPB
• Manufacturer: National Semiconductor
• Type: Standardr

Specifications of LMC555CM/HFPB

• # Internal Timers: 1
• Power Dissipation: 740mW
• Propagation Delay Time: 100ns
• Operating Supply Voltage (typ): 1.5V
• Package Type: SOIC N
• High Level Output Current: -10mA
• Low Level Output Current: 50mA
• Pin Count: 8
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Not Compliant

Symbol
I
V
V
V
V
V
I
V
I
I
I
t
∆t/∆V
S
TRIG
RES
THRESH
DIS
CTRL
DIS
OL
OH
TRIG
RES
Absolute Maximum Ratings
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Note: See AN-450 “Surface Mounting Methods and Their Effect on Product
Operating Ratings
Electrical Characteristics
Test Circuit, T = 25˚C, all switches open, RESET to V
Supply Voltage, V
Input Voltages, V
V
Output Voltages, V
Output Current I
Storage Temperature Range
Soldering Information
THRESH
MDIP Soldering (10 seconds)
SOIC, MSOP Vapor Phase (60 sec)
SOIC, MSOP Infrared (15 sec)
S
Reliability” for other methods of soldering surface mount devices.
Termperature
Range
Parameter
Supply Current
Control Voltage
Discharge Saturation Voltage V
Output Voltage (Low)
Output Voltage
(High)
Trigger Voltage
Trigger Current
Reset Voltage
Reset Current
Threshold Current
Discharge Leakage
Timing Accuracy
Timing Shift with Supply
O
TRIG
, I
+
O
DIS
, V
, V
DIS
RES
, V
(Notes 2, 3)
CTRL
−40˚C to +85˚C
,
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
SW 2, 4 Closed
V
V
V
V
−0.3V to V
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
−65˚C to +150˚C
(Notes 1, 2)
= 1.5V
= 5V
= 12V
= 1.5V
= 5V
= 12V
= 1.5V, I
= 5V, I
= 1.5V, I
= 5V, I
= 12V, I
= 1.5V, I
= 5V, I
= 12V, I
= 1.5V
= 12V
= 5V
= 1.5V (Note 4)
= 12V
= 5V
= 5V
= 12V
= 1.5V
= 5V
= 12V
= 5V
(Notes 2, 3)
±
DIS
O
O
S
1V
O
O
100 mA
DIS
O
O
= 8 mA
= −2 mA
S
+ 0.3V
= 50 mA
= −10 mA
260˚C
215˚C
220˚C
= 10 mA
= 1 mA
= −0.25 mA
unless otherwise noted
= 1 mA
15V
15V
Conditions
3
Thermal Resistance (θ
Outline
Mini Small
Molded Dip
SMD
Maximum
Allowable Power
Dissipation
SMD
SO, 8-Pin Small
MSOP, 8-Pin
Outline
MDIP, 8-Pin
8-Bump micro
MDIP-8
SO-8
MSOP-8
8 Bump micro
@
25˚C
10.5
Min
0.8
2.9
7.4
1.0
4.4
0.4
3.7
0.4
0.4
0.9
1.0
1.0
JA
1.25
11.3
0.75
Typ
100
150
150
1.0
3.3
8.0
0.2
0.3
1.0
4.7
0.5
4.0
0.7
1.0
1.1
1.1
1.1
0.3
) (Note 2)
50
75
10
10
10
1126 mW
Max
1.25
1.20
1.25
150
250
400
150
300
100
1.2
3.8
8.6
0.4
0.6
2.0
0.6
4.3
1.0
1.1
169˚C/W
225˚C/W
111˚C/W
220˚C/W
740 mW
555 mW
568 mW
www.national.com
(Limits)
Units
%/V
mV
ms
µA
pA
pA
pA
nA
V
V
V
V
V